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Pub. No.: WO/2009/119465 International Application No.: PCT/JP2009/055566
Publication Date: 01.10.2009 International Filing Date: 16.03.2009
Chapter 2 Demand Filed: 04.11.2009
H01G 9/155 (2006.01) ,H01M 2/02 (2006.01)
Applicants: HAGIWARA, Naoto[JP/JP]; JP (UsOnly)
ISHIDA, Katsuei[JP/JP]; JP (UsOnly)
YAWATA, Kazushi[JP/JP]; JP (UsOnly)
KOBAYASHI, Motoki[JP/JP]; JP (UsOnly)
TAIYO YUDEN CO., LTD.[JP/JP]; 16-20, Ueno 6-chome, Taito-ku Tokyo 1100005, JP (AllExceptUS)
Inventors: HAGIWARA, Naoto; JP
ISHIDA, Katsuei; JP
YAWATA, Kazushi; JP
Priority Data:
(JA) 電気化学デバイス
Abstract: front page image
(EN) Provided is an electrochemical device applicable to high-temperature reflow soldering wherein a lead-free solder is used. An electric double layer capacitor (10-1) is provided with a package (14), which is composed of films and has sealing sections (14a1-14a3) which are formed by sealing, by heat sealing or the like, portions where the films overlap with each other. Each of the sealing sections (14a1-14a3) of the package (14) is entirely covered, in a closely bonded state, with a supporting body (16) having a rigidity higher than that of the film constituting the package (14).
(FR) L'invention porte sur un dispositif électrochimique applicable à un soudage par fusion haute température dans lequel une soudure sans plomb est utilisée. Un condensateur double couche électrique (10-1) est muni d'un boîtier (14), qui est composé de films et qui comprend des sections d’étanchéité (14a1-14a3) qui sont formées en rendant étanches, par un soudage thermique ou similaire, des parties où les films se chevauchent. Chacune des sections d’étanchéité (14a1-14a3) du boîtier (14) est entièrement recouverte, dans un état étroitement lié, d'un corps de support (16) ayant une rigidité supérieure à celle du film constituant le boîtier (14).
(JA) 鉛フリー半田を使用した高温のリフロー半田付けに対応できる電気化学デバイスを提供する。電気二重層キャパシタ10‐1は、フィルムで構成され、フィルムが重なり合う部分を例えばヒートシール等によりシールして形成された封止部14a1~14a3を有するパッケージ14を備える。このパッケージ14の封止部14a1~14a3は各々の全体が、パッケージ14を構成するフィルムよりも高い剛性を有する支持体16によって密着状態で覆われている。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (EPO) (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)