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Machine translation
1. (WO2009119289) HEAT PIPE, METHOD OF MANUFACTURING HEAT PIPE, AND CIRCUIT BOARD WITH HEAT PIPE FUNCTION
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2009/119289    International Application No.:    PCT/JP2009/054415
Publication Date: 01.10.2009 International Filing Date: 09.03.2009
Chapter 2 Demand Filed:    24.08.2009    
IPC:
F28D 15/02 (2006.01), H01L 23/427 (2006.01), H05K 1/02 (2006.01), H05K 7/20 (2006.01)
Applicants: FUCHIGAMI MICRO CO., LTD. [JP/JP]; 1, Nanei 3-Chome, Kagoshima-Shi, Kagoshima 8910204 (JP) (For All Designated States Except US).
KAGOSHIMA UNIVERSITY [JP/JP]; 21-24, Korimoto 1-Chome, Kagoshima-Shi, Kagoshima 8908580 (JP) (For All Designated States Except US).
MIZUTA, Kei [JP/JP]; (For US Only).
TSURUTA, Katsuya [JP/JP]; (For US Only).
KOTANI, Toshiaki [JP/JP]; (For US Only).
OHSAWA, Kenji [JP/JP]; (For US Only)
Inventors: MIZUTA, Kei; .
TSURUTA, Katsuya; .
KOTANI, Toshiaki; .
OHSAWA, Kenji;
Agent: HIRANO, Kazuyuki; Hirano Patent Office 1-23-203, Tenjin 4-Chome Chuo-Ku, Fukuoka-Shi, Fukuoka 8100001 (JP)
Priority Data:
2008-080862 26.03.2008 JP
Title (EN) HEAT PIPE, METHOD OF MANUFACTURING HEAT PIPE, AND CIRCUIT BOARD WITH HEAT PIPE FUNCTION
(FR) CALODUC, PROCÉDÉ DE FABRICATION DE CALODUC ET CARTE DE CIRCUIT AVEC FONCTION DE CALODUC
(JA) ヒートパイプ、ヒートパイプの製造方法およびヒートパイプ機能付き回路基板
Abstract: front page image
(EN)A heat pipe (1) is provided with a flat plate-like upper plate (2), a flat plate-like lower plate (3) opposed to the upper plate (2), and flat plate-like intermediate plates (10) overlaid on each other between the upper plate (2) and the lower plate (3) and having internal through-holes (11). The internal through-holes (11) formed in each of the intermediate plates (10) are adapted such that only a part of each through-hole (11) is overlapped on each other to form capillary tube paths (15) each having a cross-sectional area smaller than the cross-sectional area, in a flat surface direction, of the through-hole (11). The upper plate (2), the lower plate (3), and the intermediate plates (10) each have an external through-hole (12). The external through-hole (12) in the upper plate (2), the external through-hole (12) in the lower plate (3), and the external through-hole (12) in the intermediate plates (10) are superposed on each other to form a via hole (4).
(FR)Un caloduc (1) est pourvu d'une plaque supérieure de type plaque plate (2), d'une plaque inférieure de type plaque plate (3) opposée à la plaque supérieure (2), et de plaques intermédiaires de type plaque plate (10) reposant l'une sur l'autre entre la plaque supérieure (2) et la plaque inférieure (3) et comportant des trous traversants internes (11). Les trous traversants internes (11) formés dans chacune des plaques intermédiaires (10) sont adaptés de sorte que seule une partie de chaque trou traversant (11) est chevauchée sur l'autre pour former des trajets de tube capillaire (15) ayant chacun une aire en coupe plus petite que l'aire en coupe, dans une direction de surface plate, du trou traversant (11). La plaque supérieure (2), la plaque inférieure (3) et les plaques intermédiaires (10) ont chacune un trou traversant externe (12). Le trou traversant externe (12) dans la plaque supérieure (2), le trou traversant externe (12) dans la plaque inférieure (3), et le trou traversant externe (12) dans les plaques intermédiaires (10) sont superposés les uns sur les autres pour former un trou d'interconnexion (4).
(JA) 本発明のヒートパイプ(1)は、平板状の上部板(2)と、上部板(2)と対向する平板状の下部板(3)と、上部板(2)と下部板(3)の間に積層されると共に内部貫通孔(11)を有する平板状の複数の中間板(10)を備え、複数の中間板(10)のそれぞれに設けられた内部貫通孔(11)同士は、それぞれの一部のみが重なって、内部貫通孔(11)の平面方向の断面積よりも小さい断面積を有する毛細管流路(15)が形成され、上部板(2)、下部板(3)および複数の中間板(10)のそれぞれは、外部貫通孔(12)を有し、上部板(2)に設けられた外部貫通孔(12)、下部板(3)に設けられた外部貫通孔(12)および中間板(10)に設けられた外部貫通孔(12)のそれぞれが重なり合ってビアホール(4)が形成される。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)