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Machine translation
1. (WO2009118935) FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2009/118935    International Application No.:    PCT/JP2008/068357
Publication Date: 01.10.2009 International Filing Date: 09.10.2008
IPC:
H05K 3/46 (2006.01)
Applicants: IBIDEN CO., LTD. [JP/JP]; 2-1, Kanda-cho, Ogaki-shi, Gifu, 5038604 (JP)
Inventors: TAKAHASHI, Michimasa; (JP).
AOYAMA, Masakazu; (JP)
Agent: KIMURA, Mitsuru; 2nd Floor, Kyohan Building, 7, Kandanishiki-cho 2-chome, Chiyoda-ku, Tokyo, 1010054 (JP)
Priority Data:
61/039,614 26.03.2008 US
Title (EN) FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
(FR) PLAQUETTE DE CIRCUITS IMPRIMÉS FLEXO-RIGIDE, ET PROCÉDÉ DE FABRICATION ASSOCIÉ
(JA) フレックスリジッド配線板及びその製造方法
Abstract: front page image
(EN)A flex-rigid wiring board (10) is composed of rigid boards (11, 12) and a flexible board (13) which connects the rigid boards (11, 12) to each other. A folding section composed of bending sections (130a-130h) is formed on the flexible board (13). Then, the flexible board (13), including the folding sections, is stored between the rigid boards (11, 12).
(FR)Selon la présente invention, une plaquette de circuits imprimés flexo-rigide (10) comprend des plaques rigides (11, 12) et une plaque flexible (13) qui connecte les plaques rigides (11, 12) l'une à l'autre. Une section de pliage composée de sections recourbées (130a-130h) est formée sur la plaque flexible (13). Ensuite, la plaque flexible (13) comprenant les sections de pliage, est insérée entre les plaques rigides (11, 12).
(JA) リジッド基板(11、12)と、それらリジッド基板(11、12)を相互に接続するフレキシブル基板(13)とから構成されるフレックスリジッド配線板(10)において、フレキシブル基板(13)に、屈曲部(130a乃至130h)からなる折り畳み部を形成する。そして、フレキシブル基板(13)を、その折り畳み部を含めて、リジッド基板(11、12)の間に収納する。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)