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Machine translation
1. (WO2009118916) MULTI-CHIP HYBRID-MOUNTED DEVICE AND METHOD OF MANUFACTURING THE SAME
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2009/118916    International Application No.:    PCT/JP2008/056625
Publication Date: 01.10.2009 International Filing Date: 27.03.2008
IPC:
H01S 5/022 (2006.01), G02B 6/122 (2006.01), G02B 6/42 (2006.01)
Applicants: NEC Corporation [JP/JP]; 7-1, Shiba 5-chome, Minato-ku, Tokyo, 1088001 (JP) (For All Designated States Except US).
TODT, Rene [DE/JP]; (JP) (For US Only)
Inventors: TODT, Rene; (JP)
Agent: IKEDA, Noriyasu; The 3rd Mori Building, 4-10, Nishishinbashi 1-chome, Minato-ku, Tokyo 1050003 (JP)
Priority Data:
Title (EN) MULTI-CHIP HYBRID-MOUNTED DEVICE AND METHOD OF MANUFACTURING THE SAME
(FR) CIRCUIT MULTIPUCE À MONTAGE HYBRIDE ET PROCÉDÉ DE FABRICATION DE CELUI-CI
Abstract: front page image
(EN)A multi-chip hybrid-mounted device is provided that is fabricated by an extremely simple fabrication process, thereby enabling excellent reliability and yield. During the mounting process, the submount is kept at a bias temperature slightly below the solder melting point. For each chip to be mounted, an auxiliary heater element located adjacent to the actual mounting/soldering position is temporarily energized. Using a bias temperature, a local temperature increase of only a few degrees Celsius in the mounting/soldering area will initiate the soldering process and affix the chip. Such a small temperature increase is readily achieved by the laterally displaced heater element with only a minimal amount of thermal stress. The fabrication process is fully scalable and enables mounting of an arbitrarily large number of chips using only a single solder material.
(FR)La présente invention concerne un circuit multipuce à montage hybride fabriqué selon un processus de fabrication extrêmement simple, offrant ainsi une fiabilité et un rendement excellents. Durant le processus de montage, l'embase est maintenue à une température de polarisation légèrement inférieure au point de fusion de soudure. Pour chaque puce à monter, un élément chauffant auxiliaire adjacent à la position réelle de montage/soudage est excité temporairement. En utilisant une température de polarisation, une hausse de température locale de quelques degrés Celsius seulement dans la zone de montage/soudage déclenche un processus de soudage et fixe la puce. Cette faible hausse de température est promptement obtenue par déplacement latéral de l'élément chauffant, avec un degré minime de contrainte thermique. Le processus de fabrication est entièrement évolutif et permet le montage d'un nombre de puces arbitrairement important en n'utilisant qu'un seul matériau de soudage.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)