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Machine translation
1. (WO2009066099) LED CHIP THERMAL MANAGEMENT AND FABRICATION METHODS
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2009/066099    International Application No.:    PCT/GB2008/051072
Publication Date: 28.05.2009 International Filing Date: 17.11.2008
IPC:
H01L 33/00 (2010.01)
Applicants: WANG, Wang Nang [--/GB]; (GB)
Inventors: WANG, Wang Nang; (GB)
Agent: EMERSON, Peter James; Whitefriars, Lewins Mead, Bristol Bristol BS1 2NT (GB)
Priority Data:
11/942,109 19.11.2007 US
Title (EN) LED CHIP THERMAL MANAGEMENT AND FABRICATION METHODS
(FR) PROCÉDÉS DE GESTION THERMIQUE ET DE FABRICATION DE PUCE DEL
Abstract: front page image
(EN)The present invention relates to a method of fabricating a high power light-emitting device using an electrolessly or electrolytically plated metal composite heat dissipation substrate of high thermal conductivity and of thermal expansion coefficient matched with the device.
(FR)La présente invention porte sur un procédé de fabrication d'un dispositif émetteur de lumière de forte puissance à l'aide d'un substrat de dissipation thermique composite de métal revêtu de façon auto-catalytique ou électrolytique de conductivité thermique élevée et de coefficient de dilatation thermique adapté au dispositif.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)