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Pub. No.:    WO/2009/063825    International Application No.:    PCT/JP2008/070404
Publication Date: 22.05.2009 International Filing Date: 10.11.2008
H01L 21/301 (2006.01), H01L 21/683 (2006.01)
Applicants: Tokyo Seimitsu Co., Ltd. [JP/JP]; 9-7-1, Shimorenjaku, Mitaka-city Tokyo 1818515 (JP) (For All Designated States Except US).
SHIMIZU, Tasuku [JP/JP]; (JP) (For US Only).
HIRANO, Tetsuya [JP/JP]; (JP) (For US Only)
Inventors: SHIMIZU, Tasuku; (JP).
HIRANO, Tetsuya; (JP)
Agent: MATSUURA, Kenzo; Matsuura & Associates, P.O. Box 176, Shinjuku Sumitomo Bldg. 39F 6-1, Nishi-shinjuku 2-chome Shinjuku-ku, Tokyo 1630239 (JP)
Priority Data:
2007-298226 16.11.2007 JP
(JA) ウェーハ処理装置
Abstract: front page image
(EN)A wafer processing apparatus (10) is provided with a storing section (14), a cooling section (16), an expanding section (18), a cleaning section (24), an ultraviolet irradiation section (26) and a wafer transfer section (28) at prescribed positions on a main body (12). The wafer transfer section (28) permits required processing to be performed at each section, while transferring a wafer (W) having a frame member in a prescribed order. Thus, the wafer processing apparatus (10) continuously and automatically performs expanding process, cleaning process and ultraviolet irradiation process to the wafer after dicing without damaging a chip.
(FR)Un appareil de traitement de tranche (10) est doté d'une section de stockage (14), d'une section de refroidissement (16), d'une section d'expansion (18), d'une section de nettoyage (24), d'une section de rayonnement ultraviolet (26) et d'une section de transfert de tranche (28) à des positions prescrites sur un corps principal (12). La section de transfert de tranche (28) permet de réaliser le traitement requis à chaque section, tout en transférant une tranche (W) ayant un élément de cadre dans un ordre prescrit. Ainsi, l'appareil de traitement de tranche (10) réalise continûment et automatiquement le procédé d'expansion, le procédé de nettoyage et le procédé de rayonnement ultraviolet sur la tranche après le découpage en dés sans endommager une puce.
(JA) ウェーハ処理装置(10)は、本体(12)の所定の位置に収容部(14)、冷却部(16)、エキスパンド部(18)、洗浄部(24)、紫外線照射部(26)を設けるとともにウェーハ搬送部(28)を備える。このウェーハ搬送部(28)は、フレーム部材付きウェーハ(W)を所定の順序に従って搬送しながら、各部において必要な処理を自動で実行することが可能である。これにより、ウェーハ処理装置(10)は、ダイシング後のウェーハのエキスパンド処理、洗浄処理、及び紫外線照射処理を、チップにダメージを与えることなく連続かつ自動で行うことができる。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)