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1. (WO2009060902) CERAMIC SUBSTRATE, METHOD FOR PRODUCING CERAMIC SUBSTRATE, AND METHOD FOR PRODUCING SUBSTRATE FOR POWER MODULE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2009/060902    International Application No.:    PCT/JP2008/070219
Publication Date: 14.05.2009 International Filing Date: 06.11.2008
IPC:
H05K 1/03 (2006.01), H01L 23/15 (2006.01), H05K 1/02 (2006.01), H05K 3/00 (2006.01)
Applicants: MITSUBISHI MATERIALS CORPORATION [JP/JP]; 3-2, Otemachi 1-chome, Chiyoda-ku, Tokyo 1008117 (JP) (For All Designated States Except US).
TONOMURA, Hiroshi [JP/JP]; (JP) (For US Only).
KITAHARA, Takeshi [JP/JP]; (JP) (For US Only).
ISHIZUKA, Hiroya [JP/JP]; (JP) (For US Only).
KUROMITSU, Yoshirou [JP/JP]; (JP) (For US Only).
NAGATOMO, Yoshiyuki [JP/JP]; (JP) (For US Only)
Inventors: TONOMURA, Hiroshi; (JP).
KITAHARA, Takeshi; (JP).
ISHIZUKA, Hiroya; (JP).
KUROMITSU, Yoshirou; (JP).
NAGATOMO, Yoshiyuki; (JP)
Agent: SHIGA, Masatake; 1-9-2, Marunouchi, Chiyoda-ku Tokyo 1006620 (JP)
Priority Data:
2007-288287 06.11.2007 JP
2008-072509 19.03.2008 JP
2008-271036 21.10.2008 JP
2008-271037 21.10.2008 JP
Title (EN) CERAMIC SUBSTRATE, METHOD FOR PRODUCING CERAMIC SUBSTRATE, AND METHOD FOR PRODUCING SUBSTRATE FOR POWER MODULE
(FR) SUBSTRAT EN CÉRAMIQUE, PROCÉDÉ DE FABRICATION D'UN SUBSTRAT EN CÉRAMIQUE, ET PROCÉDÉ DE FABRICATION D'UN SUBSTRAT POUR UN MODULE DE PUISSANCE
(JA) セラミックス基板、セラミックス基板の製造方法及びパワーモジュール用基板の製造方法
Abstract: front page image
(EN)Disclosed is a ceramic substrate containing silicon, wherein the concentration of silicon oxide and silicon complex oxides in the surface of the substrate is not more than 2.7 atom%.
(FR)L'invention concerne un substrat en céramique contenant du silicium, la concentration d'oxyde de silicium et d'oxydes complexes de silicium dans la surface du substrat étant égale ou inférieure à 2,7 % atomique.
(JA) 珪素を含有するセラミックス基板であって、同基板の表面における酸化シリコン及びシリコンの複合酸化物の濃度が、2.7Atom%以下である。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)