WIPO logo
Mobile | Deutsch | Español | Français | 日本語 | 한국어 | Português | Русский | 中文 | العربية |
PATENTSCOPE

Search International and National Patent Collections
World Intellectual Property Organization
Search
 
Browse
 
Translate
 
Options
 
News
 
Login
 
Help
 
Machine translation
1. (WO2009057710) SUBSTRATE HOLDING MEMBER, SUBSTRATE BONDING APPARATUS, APPARATUS FOR MANUFACTURING MULTILAYER SUBSTRATE, SUBSTRATE BONDING METHOD, METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE, AND METHOD FOR MANUFACTURING MULTILAYER SEMICONDUCTOR DEVICE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2009/057710    International Application No.:    PCT/JP2008/069793
Publication Date: 07.05.2009 International Filing Date: 30.10.2008
IPC:
H01L 21/02 (2006.01)
Applicants: NIKON CORPORATION [JP/JP]; 2-3, Marunouchi 3-chome, Chiyoda-ku, Tokyo 1008331 (JP) (For All Designated States Except US).
MAEDA, Hidehiro [JP/JP]; (JP) (For US Only).
KATAGIRI, Satoshi [JP/JP]; (JP) (For US Only)
Inventors: MAEDA, Hidehiro; (JP).
KATAGIRI, Satoshi; (JP)
Agent: RYUKA, Akihiro; 5F, Shinjuku Square Tower, 22-1, Nishi-Shinjuku 6-chome, Shinjuku-ku, Tokyo 1631105 (JP)
Priority Data:
2007-281200 30.10.2007 JP
2008-199553 01.08.2008 JP
2008-199554 01.08.2008 JP
Title (EN) SUBSTRATE HOLDING MEMBER, SUBSTRATE BONDING APPARATUS, APPARATUS FOR MANUFACTURING MULTILAYER SUBSTRATE, SUBSTRATE BONDING METHOD, METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE, AND METHOD FOR MANUFACTURING MULTILAYER SEMICONDUCTOR DEVICE
(FR) ÉLÉMENT DE SUPPORT DE SUBSTRAT, APPAREIL ET PROCÉDÉ DE LIAISON DE SUBSTRAT, APPAREIL ET PROCÉDÉ POUR FABRIQUER UN SUBSTRAT MULTICOUCHE ET PROCÉDÉ POUR FABRIQUER UN DISPOSITIF À SEMI-CONDUCTEURS MULTICOUCHE
(JA) 基板保持部材、基板接合装置、積層基板製造装置、基板接合方法、積層基板製造方法および積層型半導体装置製造方法
Abstract: front page image
(EN)Substrates are bonded by using a substrate holding member which sandwiches bonding substrates by an attracting force of a permanent magnet. The substrate holding member holds a pair of substrates which are aligned and laminated with each other. The substrate holding member is provided with a first holding member for holding one of the pair of substrates; a plurality of members which are connected to the first holding member and are to be bonded; a second holding member which faces one of the pair of substrates and holds the other substrate; a plurality of bonding members, which have an attracting force that operates to the members to be bonded and are connected to the second holding members corresponding to the positions of the members to be bonded; and an attraction regulating section for regulating the attracting force until the pair of substrates are aligned.
(FR)La présente invention concerne des substrats qui sont liés à l'aide d'un élément de support de substrat qui maintient fermement les substrats de liaison grâce à la force d'attraction d'un aimant permanent. L'élément de support de substrat maintient une paire de substrats alignés et stratifiés l'un avec l'autre. L'élément de support de substrat est muni de : - un premier élément de support destiné à maintenir l'un des deux substrats, - une pluralité d'éléments reliés au premier élément de support et qui doivent être liés, - un second élément de support qui fait face à l'une des paires de substrat et maintient l'autre substrat, - une pluralité d'éléments de liaison ayant une forte attraction qui opère sur les éléments à lier et reliés aux seconds éléments de liaison correspondant aux positions des éléments à lier, - une section de régulation de l'attraction permettant de réguler la force d'attraction jusqu'à ce que la paire de substrats soit alignée.
(JA) 永久磁石の吸引力により接合基板を挟む基板保持部材を用いて基板を接合する。  位置合わせして積層された一対の基板を保持する基板保持部材であって、一対の基板の一方を保持する第1保持部材と、第1保持部材に連結された複数の被結合部材と、一方に対向させて一対の基板の他方を保持する第2保持部材と、被結合部材に作用する吸着力を有して、被結合部材の位置に対応して第2保持部材に連結された複数の結合部材と、吸着力を、一対の基板が位置合わせされるまで規制する吸着規制部とを備える。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)