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1. WO2009055069 - MULTIPLE PACKAGE MODULE USING A RIGID FLEX PRINTED CIRCUIT BOARD

Publication Number WO/2009/055069
Publication Date 30.04.2009
International Application No. PCT/US2008/012177
International Filing Date 27.10.2008
IPC
H01L 23/12 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
12Mountings, e.g. non-detachable insulating substrates
CPC
H01L 2224/16
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
10Bump connectors; Manufacturing methods related thereto
15Structure, shape, material or disposition of the bump connectors after the connecting process
16of an individual bump connector
H01L 23/4985
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; ; Selection of materials therefor
488consisting of soldered ; or bonded; constructions
498Leads, ; i.e. metallisations or lead-frames; on insulating substrates, ; e.g. chip carriers
4985Flexible insulating substrates
H01L 25/0652
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; ; Multistep manufacturing processes thereof
03all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
04the devices not having separate containers
065the devices being of a type provided for in group H01L27/00
0652the devices being arranged next and on each other, i.e. mixed assemblies
H05K 1/141
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
14Structural association of two or more printed circuits
141One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
H05K 1/147
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
14Structural association of two or more printed circuits
147at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
H05K 1/148
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
14Structural association of two or more printed circuits
148Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
Applicants
  • CHIPSTACK INC. [US]/[US] (AllExceptUS)
  • ARNOLD, Shawn [US]/[US] (UsOnly)
Inventors
  • ARNOLD, Shawn
Agents
  • MOSER, Raymond, R., Jr.
Priority Data
61/000,33725.10.2007US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) MULTIPLE PACKAGE MODULE USING A RIGID FLEX PRINTED CIRCUIT BOARD
(FR) MODULE BOÎTIER MULTIPLE UTILISANT UNE CARTE À CIRCUIT IMPRIMÉ FLEX-RIGIDE
Abstract
(EN)
A multiple package module and a method of fabricating a multiple package module. The module comprises a central region of a rigid flex circuit board for mounting circuitry, and at least one wing connected by a flexible portion to at least one edge of the central region of the rigid flex circuit board.
(FR)
L'invention concerne un module boîtier multiple et un procédé de fabrication d'un module boîtier multiple. Le module comprend une région centrale d'une carte à circuit imprimé flex-rigide pour le montage de circuits, et au moins une aile reliée par une partie souple à au moins un bord de la région centrale de la carte à circuit imprimé flex-rigide.
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