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1. WO2009052815 - MICROCHANNEL HEAT SINK FOR COOLING SEMICONDUCTOR ELEMENTS AND METHOD FOR TREATING THE SURFACES THEREOF

Publication Number WO/2009/052815
Publication Date 30.04.2009
International Application No. PCT/DE2008/001771
International Filing Date 26.10.2008
IPC
H01L 23/373 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
373Cooling facilitated by selection of materials for the device
H01L 23/473 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
46involving the transfer of heat by flowing fluids
473by flowing liquids
CPC
H01L 23/3736
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
373Cooling facilitated by selection of materials for the device ; or materials for thermal expansion adaptation, e.g. carbon
3736Metallic materials
H01L 23/473
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
46involving the transfer of heat by flowing fluids
473by flowing liquids
H01L 2924/0002
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
0001Technical content checked by a classifier
0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
H01S 5/024
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
5Semiconductor lasers
02Structural details or components not essential to laser action
024Arrangements for thermal management
H01S 5/02423
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
5Semiconductor lasers
02Structural details or components not essential to laser action
024Arrangements for thermal management
02407Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
02423Liquid cooling, e.g. a liquid cools a mount of the laser
Applicants
  • LORENZEN, Dirk [DE]/[DE]
Inventors
  • LORENZEN, Dirk
Priority Data
10 2007 051 798.126.10.2007DE
Publication Language German (DE)
Filing Language German (DE)
Designated States
Title
(DE) MIKROKANALWÄRMESENKE ZUR KÜHLUNG VON HALBLEITERBAUELEMENTEN UND VERFAHREN ZUR OBERFLÄCHENBEHANDLUNG DERSELBEN
(EN) MICROCHANNEL HEAT SINK FOR COOLING SEMICONDUCTOR ELEMENTS AND METHOD FOR TREATING THE SURFACES THEREOF
(FR) DISSIPATEUR THERMIQUE À MICROCANAUX, DESTINÉ À REFROIDIR DES COMPOSANTS À SEMI-CONDUCTEUR, ET PROCÉDÉ DE TRAITEMENT DE SURFACE DUDIT DISSIPATEUR
Abstract
(DE)
Bei einer Mikrokanalwärmesenke zur Kühlung von Halbleiterbauelementen besteht die Aufgabe, bei Nutzung der Vorteile, die mit einer Oberflächenverbesserung durch eine Anschlussmetallisierung verbunden sind, korrosionsbedingte Undichtheiten zu verhindern, ohne dass die thermische Effizienz der Mikrokanalwärmesenke gemindert wird. Das wird dadurch erreicht, dass auf Dichtflächen für Dichtelemente, die Kühlmitteleinlass- und Kühlmittelauslassöffnungen umschließen und auf Innenoberflächen eines Kühlmitteleinlasses und eines Kühlmittelauslasses wenigstens eine elektrisch isolierende anorganische Schutzschicht oder wenigstens eine abschließende Schutzschicht aus wenigstens einem Refraktärmetall aufgebracht ist.
(EN)
The invention relates to a microchannel heat sink for cooling semiconductor elements. The aim of the invention is to prevent, while using the advantages related to a surface improvement brought about by a contact metallization, leakages caused by corrosion while avoiding the reduction of the thermal efficiency of the microchannel heat sink. The invention is characterized in that at least one electrically insulating inorganic protective layer or at least one final protective layer of at least one refractory metal is applied to sealing surfaces for sealing elements that enclose the coolant inlet and coolant outlet openings and to the inner surfaces of a coolant inlet and a coolant outlet.
(FR)
L'invention concerne un dissipateur thermique à microcanaux, destiné à refroidir des composants à semi-conducteur. Le but de l'invention est d'exploiter les avantages liés à l'amélioration d'une surface par une métallisation de jonction pour éviter les défauts d'étanchéité causés par la corrosion, sans réduire l'efficacité thermique du dissipateur thermique à microcanaux. A cet effet, au moins une couche de protection inorganique électriquement isolante ou au moins une couche de protection finale, constituée d'au moins un métal réfractaire, est appliquée sur des surfaces d'étanchéité d'éléments d'étanchéité, entourant les orifices d'entrée et de sortie de fluide de refroidissement, et sur des surfaces intérieures d'une entrée de fluide de refroidissement et d'une sortie de fluide de refroidissement.
Also published as
Latest bibliographic data on file with the International Bureau