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1. WO2009044530 - SURFACE TREATMENT DEVICE AND SURFACE TREATMENT SYSTEM, METHOD FOR SURFACE TREATMENT, AND BAND-SHAPED THIN BODY TREATED THEREBY

Publication Number WO/2009/044530
Publication Date 09.04.2009
International Application No. PCT/JP2008/002715
International Filing Date 29.09.2008
IPC
C25D 7/06 2006.01
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
7Electroplating characterised by the article coated
06Wires; Strips; Foils
B08B 3/04 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
08CLEANING
BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
3Cleaning by methods involving the use or presence of liquid or steam
04Cleaning involving contact with liquid
B08B 11/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
08CLEANING
BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
11Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
C23C 18/31 2006.01
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, i.e. electroless plating
31Coating with metals
CPC
B08B 11/00
BPERFORMING OPERATIONS; TRANSPORTING
08CLEANING
BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
11Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
B08B 3/04
BPERFORMING OPERATIONS; TRANSPORTING
08CLEANING
BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
3Cleaning by methods involving the use or presence of liquid or steam
04Cleaning involving contact with liquid
C23C 18/1619
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, e.g. electroless plating
1601Process or apparatus
1619Apparatus for electroless plating
C25D 7/0614
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
7Electroplating characterised by the article coated
06Wires; Strips; Foils
0614Strips or foils
Applicants
  • パナソニック株式会社 PANASONIC CORPORATION [JP]/[JP] (AllExceptUS)
  • 伊藤泉 ITO, Izumi (UsOnly)
  • 浅田博文 ASADA, Hirofumi (UsOnly)
Inventors
  • 伊藤泉 ITO, Izumi
  • 浅田博文 ASADA, Hirofumi
Agents
  • 新樹グローバル・アイピー特許業務法人 SHINJYU GLOBAL IP
Priority Data
2007-25918202.10.2007JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) SURFACE TREATMENT DEVICE AND SURFACE TREATMENT SYSTEM, METHOD FOR SURFACE TREATMENT, AND BAND-SHAPED THIN BODY TREATED THEREBY
(FR) DISPOSITIF DE TRAITEMENT DE SURFACE ET SYSTÈME DE TRAITEMENT DE SURFACE, PROCÉDÉ DE TRAITEMENT DE SURFACE, ET CORPS MINCE EN FORME DE BANDE TRAITÉ PAR UN TEL PROCÉDÉ
(JA) 表面処理装置および表面処理システム、表面処理方法、これによって処理された帯状薄体
Abstract
(EN)
A surface treatment device (10) performs a surface treatment by flowing down a predetermined treatment liquid (X) along the surface to be treated of a band-shaped thin body (S) disposed along a generally vertical direction. The surface treatment device (10) comprises a wall part (12b) disposed in proximate to the band-shaped thin body (S) disposed in the generally vertical direction through a predetermined very narrow gap (d) provided therebetween, and a supply part (13) for supplying the surface treatment liquid (X) flowing down in the gap (d).
(FR)
La présente invention concerne un dispositif de traitement de surface (10) effectuant un traitement de surface par l'écoulement d'un liquide de traitement prédéterminé (X) le long de la surface à traiter d'un corps mince en forme de bande(S) disposé selon une direction généralement verticale. Le dispositif de traitement de surface (10) comporte une partie de paroi (12b) disposée à proximité du corps mince en forme de bande(S) dans la direction généralement verticale via un espace très étroit prédéterminé (d) interposé, et une partie d'alimentation (13) pour alimenter le liquide de traitement de surface (X) s'écoulant dans l'espace (d).
(JA)
 表面処理装置(10)は、略鉛直方向に沿って配置された帯状薄体(S)における被処理面に沿って所定の表面処理液(X)を流下させて表面処理を行う装置である。そして、表面処理装置(10)は、略鉛直方向に沿って配置された帯状薄体(S)に対して所定の微小な隙間(d)を介して近接配置された壁部(12b)と、この隙間(d)内において流下する表面処理液(X)を供給する供給部(13)と、を備えている。
Also published as
Latest bibliographic data on file with the International Bureau