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1. WO2009043790 - PROJECTION OBJECTIVE FOR MICROLITHOGRAPHY

Publication Number WO/2009/043790
Publication Date 09.04.2009
International Application No. PCT/EP2008/062835
International Filing Date 25.09.2008
IPC
G03F 7/20 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
20Exposure; Apparatus therefor
G02B 13/14 2006.01
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
13Optical objectives specially designed for the purposes specified below
14for use with infra-red or ultra-violet radiation
CPC
G02B 1/02
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
1Optical elements characterised by the material of which they are made
02made of crystals, e.g. rock-salt, semi-conductors
G02B 21/33
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
21Microscopes
33Immersion oils ; , or microscope systems or objectives for use with immersion fluids
G03F 7/70341
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
70Exposure apparatus for microlithography
70216Systems for imaging mask onto workpiece
70341Immersion
G03F 7/70941
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
70Exposure apparatus for microlithography
708Construction of apparatus, e.g. environment, hygiene aspects or materials
70908Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution, removing pollutants from apparatus; electromagnetic and electrostatic-charge pollution
70941Stray fields and charges, e.g. stray light, scattered light, flare, transmission loss
Applicants
  • CARL ZEISS SMT AG [DE]/[DE] (AllExceptUS)
  • BEIERL, Helmut [DE]/[DE] (UsOnly)
  • FELDMANN, Heiko [DE]/[DE] (UsOnly)
  • HETZLER, Jochen [DE]/[DE] (UsOnly)
  • TOTZECK, Michael [DE]/[DE] (UsOnly)
Inventors
  • BEIERL, Helmut
  • FELDMANN, Heiko
  • HETZLER, Jochen
  • TOTZECK, Michael
Agents
  • LERMER, Christoph
Priority Data
10 2007 047 148.502.10.2007DE
60/976,93502.10.2007US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) PROJECTION OBJECTIVE FOR MICROLITHOGRAPHY
(FR) OBJECTIF DE PROJECTION POUR MICROLITHOGRAPHIE
Abstract
(EN)
An assembly 11 of a projection objective for microlithography comprises a number of optical elements and an aperture 14. The optical element of the assembly 11 before the last optical element oriented towards the image is a planar convex lens 12, whose convex surface 2b is oriented towards the object, and whose planar surface 2a is oriented towards the image. As a last optical element of the assembly 11 oriented towards the image, an optical terminal element 17 is provided which comprises a planar plate 19. Between the planar surface 2b of the lens 12 and the planar plate 19 of the optical terminal element 17, thus at the object oriented surface of the planar plate, and also on the image oriented surface of the planar plate of the terminal element 17 a respective immersion liquid 13b or 13a is provided. The planar plate is thus in contact with the immersion liquids 13a and 13b on both sides. By this configuration it is assured that contaminations within the immersion liquid 13a disposed on the image oriented side do not impair the planar convex lens 12. Replacing the terminal element 17 or the planar plate 19 of the terminal element 17, however, is easily possible, as soon as their imaging properties become insufficient through contamination or other impairments.
(FR)
L'invention porte sur un ensemble (11) objectif de projection pour microlithographie qui comprend un nombre d'éléments optiques et un diaphragme (14). L'élément optique de l'ensemble (11) devant le dernier élément optique orienté vers l'image est une lentille plan-convexe (12), dont la surface convexe (2b) est orientée vers l'objet et dont la surface plane (2a) est orientée vers l'image. L'invention comprend, comme dernier élément optique de l'ensemble (11) orienté vers l'image, un élément optique terminal (17) qui comprend une plaque plane (19). L'ensemble précité comprend en outre, entre la surface plane (2b) de la lentille (12) et la plaque plane (19) de l'élément optique terminal (17), c'est-à-dire à l'emplacement de la surface orientée objet de la plaque plane et également sur la surface orientée image de la plaque plane de l'élément terminal (17), un liquide d'immersion respectif (13b ou 13a). La plaque plane se trouve par conséquent en contact avec le liquide d'immersion (13a et 13b) des deux côtés. Cette configuration garantit que les contaminations présentes dans le liquide d'immersion (13a) disposé sur le côté orienté image n'endommagent pas la lentille plan-convexe (12). On peut néanmoins facilement remplacer l'élément terminal (17) ou la plaque plane (19) de l'élément terminal (17) dès que leurs propriétés d'imagerie deviennent insuffisantes en raison de la contamination ou d'autres phénomènes de dégradation.
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