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1. WO2009015138 - ENCAPSULATING SEMICONDUCTOR COMPONENTS USING VENTED MOLD

Publication Number WO/2009/015138
Publication Date 29.01.2009
International Application No. PCT/US2008/070750
International Filing Date 22.07.2008
IPC
H01L 21/56 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
56Encapsulations, e.g. encapsulating layers, coatings
CPC
H01L 21/565
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, ; e.g. sealing of a cap to a base of a container
56Encapsulations, e.g. encapsulation layers, coatings
565Moulds
H01L 2924/0002
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
0001Technical content checked by a classifier
0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applicants
  • TEXAS INSTRUMENTS INCORPORATED [US]/[US] (AllExceptUS)
  • BAUTISTA, Jesus, Bajo, Jr. [PH]/[PH] (UsOnly)
  • GENEROSA, Victor, Edgar, Estioco [PH]/[PH] (UsOnly)
  • RAGUINDIN, Fausto, Praza [PH]/[PH] (UsOnly)
Inventors
  • BAUTISTA, Jesus, Bajo, Jr.
  • GENEROSA, Victor, Edgar, Estioco
  • RAGUINDIN, Fausto, Praza
Agents
  • FRANZ, Warren, L.
Priority Data
11/781,54823.07.2007US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) ENCAPSULATING SEMICONDUCTOR COMPONENTS USING VENTED MOLD
(FR) ENCAPSULATION DE COMPOSANTS SEMI-CONDUCTEURS EN UTILISANT UN MOULE VENTILÉ
Abstract
(EN)
A mold system (100) for forming a mold cap on a semiconductor component (102) includes a mold base (104) and a mold lid that together define a mold cavity. The mold base supports the semiconductor component within the mold cavity (112). The semiconductor component defines a component footprint and footprint periphery on the mold base. A supply channel is provided in the mold lid (110) for supplying an encapsulating material (116) to the mold cavity. At least one vent channel (118) is provided in the mold base. The vent channel intersecting the footprint periphery to vent gas trapped between the semiconductor component and the mold base from the mold cavity when the encapsulating material is supplied to the mold cavity.
(FR)
L'invention concerne un système de moule (100) pour former un couvercle de moule sur un composant semi-conducteur (102), comprenant une base de moule (104) et un couvercle de moule définissant ensemble une cavité de moule. La base de moule supporte le composant semi-conducteur dans la cavité de moule (112). Le composant semi-conducteur définit une empreinte de composant et une périphérie d'empreinte sur la base de moule. Un canal d'alimentation est fourni dans le couvercle de moule (110) pour alimenter un matériau d'encapsulation (116) vers la cavité de moule. Au moins un canal de ventilation (118) est fourni dans la base de moule. Le canal de ventilation recoupe la périphérie d'empreinte pour ventiler le gaz piégé entre le composant semi-conducteur et la base de moule depuis la cavité de moule lorsque le matériau d'encapsulation est alimenté vers la cavité de moule.
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