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1. WO2009014953 - THIN SEMICONDUCTOR DIE PACKAGES AND ASSOCIATED SYSTEMS AND METHODS

Publication Number WO/2009/014953
Publication Date 29.01.2009
International Application No. PCT/US2008/070165
International Filing Date 16.07.2008
IPC
H01L 27/146 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
144Devices controlled by radiation
146Imager structures
H01L 31/0203 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
31Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength, or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
02Details
0203Containers; Encapsulations
CPC
H01L 2224/48091
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
4805Shape
4809Loop shape
48091Arched
H01L 2224/48247
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
48221the body and the item being stacked
48245the item being metallic
48247connecting the wire to a bond pad of the item
H01L 2224/484
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
484Connecting portions
H01L 2224/73257
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
732Location after the connecting process
73251on different surfaces
73257Bump and wire connectors
H01L 2224/8592
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
85using a wire connector
85909Post-treatment of the connector or wire bonding area
8592Applying permanent coating, e.g. protective coating
H01L 24/48
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
24Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
Applicants
  • MICRO TECHNOLOGY, INC. [US]/[US] (AllExceptUS)
  • CHUA, Swee, Kwang [SG]/[SG] (UsOnly)
Inventors
  • CHUA, Swee, Kwang
Agents
  • WECHKIN, John, M.
Priority Data
200705421-624.07.2007SG
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) THIN SEMICONDUCTOR DIE PACKAGES AND ASSOCIATED SYSTEMS AND METHODS
(FR) BOÎTIERS DE PUCE DE SEMI-CONDUCTEURS FINS ET SYSTÈMES ET PROCÉDÉS ASSOCIÉS
Abstract
(EN)
A system and methods for the processing of documents generated in shipping transactions using predictive data entry is disclosed. The system utilizes a Predicted Bill Entry engine and database to shift from a bill entry process to a bill review process by predicting the shipment characteristics between common sender and receiver pairs. Shipping information collected at the time of pickup or quote is converted into a temporary shipment record. The engine then compares the temporary shipment record with the predictive bill entry database. If a match is found, the user will be presented with a predictive record for bill review. Alternatively, the user can use the Predicted Bill Entry engine by entering the certain shipping information. The Predicted Bill Entry engine searches for a match in the Predicted Bill Entry database. If a match is found, the user is presented with a predictive record for bill review.
(FR)
L'invention concerne un système et des procédés pour le traitement de documents générés dans des transactions d'expédition utilisant une entrée de données prédictive. Le système utilise un moteur d'entrée de facture prédite et une base de données pour passer d'un procédé d'entrée de facture à un procédé de visualisation de facture en prédisant les caractéristiques d'expédition entre des paires communes d'expéditeur et de récepteur. Des informations d'expédition rassemblées au moment de l'enlèvement ou du devis sont converties en un enregistrement d'expédition temporaire. Le moteur compare alors l'enregistrement d'expédition temporaire avec la base de données d'entrée de facture prédictive. Si une concordance est trouvée, l'utilisateur se verra présenter un enregistrement prédictif pour une visualisation de facture. En variante, l'utilisateur peut utiliser le moteur d'entrée de facture prédite en entrant les informations d'expédition sûres. Le moteur d'entrée de facture prédite cherche une concordance dans la base de données d'entrée de facture prédite. Si une concordance est trouvée, l'utilisateur se voit présenter un enregistrement prédictif pour une visualisation de facture.
Also published as
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