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1. WO2009013947 - NON-RECIPROCAL CIRCUIT ELEMENT

Publication Number WO/2009/013947
Publication Date 29.01.2009
International Application No. PCT/JP2008/060539
International Filing Date 09.06.2008
IPC
H01P 1/36 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
PWAVEGUIDES; RESONATORS, LINES OR OTHER DEVICES OF THE WAVEGUIDE TYPE
1Auxiliary devices
32Non-reciprocal transmission devices
36Isolators
CPC
H01P 1/36
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
1Auxiliary devices
32Non-reciprocal transmission devices
36Isolators
H05K 2201/083
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
08Magnetic details
083Magnetic materials
H05K 2201/2081
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
20Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
2081Compound repelling a metal, e.g. solder
H05K 2203/0315
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2203Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
03Metal processing
0315Oxidising metal
H05K 2203/107
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2203Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
10Using electric, magnetic and electromagnetic fields; Using laser light
107Using laser light
H05K 3/3452
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
30Assembling printed circuits with electric components, e.g. with resistor
32electrically connecting electric components or wires to printed circuits
34by soldering
3452Solder masks
Applicants
  • 株式会社村田製作所 MURATA MANUFACTURING CO., LTD. [JP]/[JP] (AllExceptUS)
  • 川浪 崇 KAWANAMI, Takashi [JP]/[JP] (UsOnly)
Inventors
  • 川浪 崇 KAWANAMI, Takashi
Agents
  • 森下 武一 MORISHITA, Takekazu
Priority Data
2007-18997920.07.2007JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) NON-RECIPROCAL CIRCUIT ELEMENT
(FR) ELÉMENT DE CIRCUIT NON RÉCIPROQUE
(JA) 非可逆回路素子
Abstract
(EN)
Provided is a non-reciprocal circuit element which improves stability and reliability of solder connection between a terminal electrode of a circuit board and an electrode arranged on ferrite. The non-reciprocal circuit element is provided with a permanent magnet; ferrite to which a direct current magnetic field is applied by the permanent magnet; first and second center electrodes arranged on the ferrite; and a circuit board (20). A connecting electrode arranged on the ferrite is electrically connected through solder to terminal electrodes (25a, 25b, 25c) formed on the circuit board (20). On the terminal electrodes (25a, 25b), solder flow preventing sections (27a, 27b) are formed by laser irradiation. The solder applied on extending sections (25a', 25b') of the terminal electrodes (25a, 25b) are blocked by the preventing sections (27a, 27b) when the solder is molten, and the solder is prevented from flowing out to the main body side of the terminal electrodes (25a, 25b).
(FR)
L'invention propose un élément de circuit non réciproque qui améliore la stabilité et la fiabilité d'une connexion par soudure entre une électrode de borne d'une carte de circuit imprimé et une électrode agencée sur de la ferrite. L'élément de circuit non réciproque est pourvu d'un aimant permanent ; de la ferrite à laquelle un champ magnétique continu est appliqué par l'aimant permanent ; des première et seconde électrodes centrales agencées sur la ferrite ; et une carte de circuit imprimé(20). Une électrode de connexion agencée sur la ferrite est électriquement connectée par l'intermédiaire d'une soudure à des électrodes de borne (25a, 25b, 25c) formées sur la carte de circuit imprimé (20). Sur les électrodes de borne (25a, 25b), des sections empêchant un écoulement de soudure (27a, 27b) sont formées par irradiation au laser. La soudure appliquée sur des sections d'extension (25a', 25b') des électrodes de borne (25a, 25b) est bloquée par les sections de prévention (27a, 27b) lorsque la soudure est fondue, et lesdites sections empêchent la soudure de s'écouler hors du côté de corps principal des électrodes de borne (25a, 25b).
(JA)
 回路基板の端子電極とフェライトに設けた電極との間のはんだ接続の安定性、信頼性を向上させることのできる非可逆回路素子を得る。  永久磁石と、該永久磁石により直流磁界が印加されるフェライトと、該フェライトに配置された第1及び第2の中心電極と、回路基板(20)とを備えた非可逆回路素子。フェライトに設けた接続用電極が回路基板(20)上に形成した端子電極(25a,25b,25c)にはんだを介して電気的に接続される。端子電極(25a,25b)にはレーザの照射によってはんだ流れ防止部(27a,27b)が形成されている。端子電極(25a,25b)の延長部(25a’,25b’)上に付与されたはんだは、溶融した際に防止部(27a,27b)で遮られ、端子電極(25a,25b)の本体側に流出することはない。
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