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1. WO2009013880 - PAD MOLDING MOLD AND PAD

Publication Number WO/2009/013880
Publication Date 29.01.2009
International Application No. PCT/JP2008/001905
International Filing Date 16.07.2008
IPC
G03G 15/20 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
GELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
15Apparatus for electrographic processes using a charge pattern
20for fixing, e.g. by using heat
B29C 33/12 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
33Moulds or cores; Details thereof or accessories therefor
12with incorporated means for positioning inserts, e.g. labels
CPC
B29C 33/12
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
33Moulds or cores; Details thereof or accessories therefor
12with incorporated means for positioning inserts, e.g. labels
G03G 15/20
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
GELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
15Apparatus for electrographic processes using a charge pattern
20for fixing, e.g. by using heat
Applicants
  • 昭和電線デバイステクノロジー株式会社 SWCC SHOWA DEVICE TECHNOLOGY CO., LTD. [JP]/[JP] (AllExceptUS)
  • 藤田剛士 FUJITA, Takeshi [JP]/[JP] (UsOnly)
  • 倉田博司 KURATA, Hiroshi [JP]/[JP] (UsOnly)
  • 山崎新司 YAMAZAKI, Shinji [JP]/[JP] (UsOnly)
Inventors
  • 藤田剛士 FUJITA, Takeshi
  • 倉田博司 KURATA, Hiroshi
  • 山崎新司 YAMAZAKI, Shinji
Agents
  • 守谷一雄 MORIYA, Kazuo
Priority Data
2007-19051523.07.2007JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) PAD MOLDING MOLD AND PAD
(FR) MOULE POUR MOULAGE DE PLAQUETTE ET PLAQUETTE
(JA) パッド成型金型及びパッド
Abstract
(EN)
This invention provides a pad molding mold which can ensure a necessary bonding area between a rubber material of a pressing pad (26) and a wire (24) and can prevent the occurrence of waving and bending of a wire (24) after molding. In a two-split mold for molding a pressing pad (26) having a pressing face (22) for pressing the outer peripheral surface of a fixing roller (16), a holding groove (42) for providing a wire (24) attached along one side of the pressing face (22) is provided in one split mold (29a) in the two-split mold. A plurality of protrusions (46) for pressing the outer surface of the wire (24) is intermittently provided in the longitudinal direction in the other split mold (29b), in the two-split mold, at its site opposed to the holding groove (42). The fixing roller (16) includes a pressing roller, and the pressing pad (26) includes a fixing pad.
(FR)
Cette invention concerne un moule pour moulage de plaquette qui peut assurer une surface de liaison nécessaire entre un matériau caoutchouc d'une plaquette de pression (26) et un fil (24) et peut empêcher l'apparition d'une ondulation et d'une flexion d'un fil (24) après moulage. Dans un moule à deux coins pour mouler une plaquette de pression (26) ayant une face de pression (22) pour presser la surface périphérique externe d'un rouleau de fixation (16), une rainure de maintien (42) pour disposer un fil (24) attaché le long d'un côté de la face de pression (22) est disposée dans un coin (29a) dans le moule à deux coins. Plusieurs protubérances (46) pour presser la surface externe du fil (24) sont disposées de façon intermittente dans la direction longitudinale de l'autre coin (29b), dans le moule à deux coins, au niveau de son site opposé à la rainure de maintien (42). Le rouleau de fixation (16) comprend un rouleau de pression et la plaquette de pression (26) comprend une plaquette de fixation.
(JA)
 加圧パッド26のゴム材料とワイヤ24との必要な接着面積を確保でき、成型後ワイヤ24のうねり、曲がりの発生を防止できるパッド成型金型を提供する。  定着ローラ16外周面を押圧する押当て面22を有する加圧パッド26を成型する2つ割りの金型であって、金型の一方の割り型29aには、押当て面22の一辺に沿って添設されるワイヤ24を配備するための保持溝42を設け、金型の他方の割り型29bの、保持溝42に対向する部位には、ワイヤ24外面を押えるための複数の突起46を長さ方向に断続的に設けた。なお、定着ローラ16には加圧ローラが含まれ、加圧パッド26には定着パッドが含まれる。
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