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1. WO2009011376 - WIRELESS IC DEVICE

Publication Number WO/2009/011376
Publication Date 22.01.2009
International Application No. PCT/JP2008/062886
International Filing Date 17.07.2008
IPC
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
Q
AERIALS
1
Details of, or arrangements associated with, aerials
50
Structural association of aerials with earthing switches, lead-in devices, or lightning protectors
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
K
RECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
19
Record carriers for use with machines and with at least a part designed to carry digital markings
06
characterised by the kind of the digital marking, e.g. shape, nature, code
067
Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards
07
with integrated circuit chips
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
K
RECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
19
Record carriers for use with machines and with at least a part designed to carry digital markings
06
characterised by the kind of the digital marking, e.g. shape, nature, code
067
Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards
07
with integrated circuit chips
077
Constructional details, e.g. mounting of circuits in the carrier
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
Q
AERIALS
1
Details of, or arrangements associated with, aerials
36
Structural form of radiating elements, e.g. cone, spiral, umbrella
38
formed by a conductive layer on an insulating support
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
Q
AERIALS
7
Loop aerials with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
Q
AERIALS
9
Electrically-short aerials having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
04
Resonant aerials
16
with feed intermediate between the extremities of the aerial, e.g. centre-fed dipole
20
Two collinear substantially straight active elements; Substantially straight single active elements
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
B
TRANSMISSION
5
Near-field transmission systems, e.g. inductive loop type
02
using transceiver
H01Q 1/50 (2006.01)
G06K 19/07 (2006.01)
G06K 19/077 (2006.01)
H01Q 1/38 (2006.01)
H01Q 7/00 (2006.01)
H01Q 9/20 (2006.01)
CPC
G06K 19/0723
G06K 19/073
G06K 19/07749
G06K 19/07756
H01L 2224/16225
H01L 2224/73204
Applicants
  • 株式会社村田製作所 Murata Manufacturing Co., Ltd. [JP/JP]; 〒6178555 京都府長岡京市東神足1丁目10番1号 Kyoto 10-1, Higashikotari 1-chome, Nagaokakyo-shi, Kyoto 6178555, JP (AllExceptUS)
  • 池本伸郎 IKEMOTO, Nobuo [JP/JP]; JP (UsOnly)
  • 道海雄也 DOKAI, Yuya [JP/JP]; JP (UsOnly)
  • 加藤登 KATO, Noboru [JP/JP]; JP (UsOnly)
Inventors
  • 池本伸郎 IKEMOTO, Nobuo; JP
  • 道海雄也 DOKAI, Yuya; JP
  • 加藤登 KATO, Noboru; JP
Agents
  • 小森久夫 KOMORI, Hisao; 〒5400011 大阪府大阪市中央区農人橋1丁目4番34号 Osaka 1-4-34, Noninbashi, Chuo-ku Osaka-shi, Osaka 5400011, JP
Priority Data
2007-18643918.07.2007JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) WIRELESS IC DEVICE
(FR) DISPOSITIF À CIRCUIT INTÉGRÉ SANS FIL
(JA) 無線ICデバイス
Abstract
(EN)
An electromagnetically coupling module is composed of a wireless IC chip (1) and a functional substrate (20), and the electromagnetically coupling module is mounted on a radiation plate (30) with an adhesive (40). On an upper surface of a base material (31) of the radiation plate (30), two long radiation electrodes (32a, 32b) are formed. On a bottom surface section of the functional substrate (20), facing capacitive coupling electrodes (24a, 24b) are arranged on the inner end sections of the radiation electrodes (32a, 32b), respectively, and a matching circuit (23) for impedance matching between the wireless IC chip (1) and the radiation electrodes (32a, 32b) is constituted. Thus, the size of the wireless IC device is reduced as a whole, designing is facilitated and cost is reduced.
(FR)
L'invention concerne un module de couplage électromagnétique qui est composé d'une puce de circuit intégré sans fil (1) et d'un substrat fonctionnel (20), et le module de couplage électromagnétique est monté sur une plaque de rayonnement (30) grâce à un adhésif (40). Sur la surface supérieure d'un matériau de base (31) de la plaque de rayonnement (30), deux électrodes de rayonnement longues (32a, 32b) sont formées. Sur une section de surface inférieure du substrat fonctionnel (20), des électrodes capacitives de couplage (24a, 24b) se faisant face sont respectivement disposées sur les sections d'extrémités internes des électrodes de rayonnement (32a, 32b), et un circuit d'adaptation (23) est constitué, destiné à une adaptation d'impédance entre la puce de circuit intégré sans fil (1) et les électrodes de rayonnement (32a, 32b). Ainsi la taille du dispositif à circuit intégré sans fil est tout entière réduite, sa conception est facilitée et son coût est réduit.
(JA)
 無線ICチップ(1)と機能基板(20)とによって電磁結合モジュールを構成し、その電磁結合モジュールを放射板(30)に接着剤(40)で実装する。放射板(30)の基材(31)の上面には長尺状の2つの放射電極(32a),(32b)を形成している。機能基板(20)の底面部には放射電極(32a),(32b)の内側の端部にそれぞれ対向する容量結合電極(24a),(24b)を備え、無線ICチップ(1)と放射電極(32a),(32b)とのインピーダンス整合をとる整合回路(23)を構成している。この構成により全体のサイズを縮小化するとともに設計を容易にし、且つ低コスト化を図る。
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