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1. WO2009008531 - POLISHING APPARATUS

Publication Number WO/2009/008531
Publication Date 15.01.2009
International Application No. PCT/JP2008/062653
International Filing Date 08.07.2008
IPC
B24B 21/08 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
21Machines or devices using grinding or polishing belts; Accessories therefor
04for grinding plane surfaces
06involving members with limited contact area pressing the belt against the work, e.g. shoes sweeping across the whole area to be ground
08Pressure shoes; Backing belts
B24B 9/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
9Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
B24B 21/16 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
21Machines or devices using grinding or polishing belts; Accessories therefor
16for grinding other surfaces of particular shape
H01L 21/304 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304Mechanical treatment, e.g. grinding, polishing, cutting
CPC
B24B 21/002
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
21Machines or devices using grinding or polishing belts
002for grinding edges or bevels
B24B 9/065
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
9Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
02characterised by a special design with respect to properties of materials specific to articles to be ground
06of non-metallic inorganic material, e.g. stone, ceramics, porcelain
065of thin, brittle parts, e.g. semiconductors, wafers
H01L 21/02021
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
02002Preparing wafers
02005Preparing bulk and homogeneous wafers
02008Multistep processes
0201Specific process step
02021Edge treatment, chamfering
Applicants
  • 株式会社 荏原製作所 EBARA CORPORATION [JP]/[JP] (AllExceptUS)
  • 高橋圭瑞 TAKAHASHI, Tamami [JP]/[JP] (UsOnly)
  • 伊藤賢也 ITO, Kenya [JP]/[JP] (UsOnly)
  • 草宏明 KUSA, Hiroaki [JP]/[JP] (UsOnly)
  • 関正也 SEKI, Masaya [JP]/[JP] (UsOnly)
Inventors
  • 高橋圭瑞 TAKAHASHI, Tamami
  • 伊藤賢也 ITO, Kenya
  • 草宏明 KUSA, Hiroaki
  • 関正也 SEKI, Masaya
Agents
  • 渡邉勇 WATANABE, Isamu
Priority Data
2007-18161611.07.2007JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) POLISHING APPARATUS
(FR) APPAREIL DE POLISSAGE
(JA) 研磨装置
Abstract
(EN)
A polishing apparatus is provided with a polishing tape (41) having a polishing surface; a substrate holding section (23) for rotating the substrate (W) by holding the substrate; a pressurizing pad (50) for pressing the polishing tape to a bevel section of the substrate held by the substrate holding section; and a polishing tape feeding mechanism (45) for advancing the polishing tape in the longitudinal direction of the tape. The pressurizing pad (50) is provided with a pad main body (53); a board-like pressing section (51) having a pressing surface (51a) for pressing the bevel section of the substrate through the polishing tape, and a rear surface (51b) positioned on the opposite side to the pressing surface; and a plurality of connecting sections (52) for connecting the pressing section and the pad main body. The pressing section is formed of a hard plastic, and a space (S) is formed between the rear surface of the pressing section and the pad main body section.
(FR)
L'invention concerne un appareil de polissage qui comporte une bande de polissage (41) ayant une surface de polissage ; une section de maintien de substrat (23) pour faire tourner le substrat (W) par le maintien du substrat ; un tampon de mise sous pression (50) pour presser la bande de polissage vers une section en biseau du substrat maintenu par la section de maintien de substrat ; et un mécanisme d'avance de bande de polissage (45) pour faire avancer la bande de polissage dans la direction longitudinale de la bande. Le tampon de mise sous pression (50) comporte un corps principal de tampon (53) ; une section de pression de type planche (51) ayant une surface de pression (51a) pour presser la section en biseau du substrat à travers la bande de polissage, et une surface arrière (51b) positionnée sur le côté opposé à la surface de pression ; et plusieurs sections de liaison (52) pour relier la section de pression et le corps principal de tampon. La section de pression est formée d'une matière plastique dure et un espace (S) est formé entre la surface arrière de la section de pression et la section de corps principal de tampon.
(JA)
本発明の研磨装置は、研磨面を有する研磨テープ(41)と、基板(W)を保持して回転させる基板保持部(23)と、基板保持部に保持された基板のベベル部に研磨テープを押圧する加圧パッド(50)と、研磨テープをその長手方向に進行させる研磨テープ送り機構(45)とを備える。加圧パッド(50)は、パッド本体部(53)と、研磨テープを介して基板のベベル部を押圧する押圧面(51a)と該押圧面の反対側に位置する裏面(51b)とを有する板状の押圧部(51)と、押圧部とパッド本体部とを連結する複数の連結部(52)とを有する。押圧部は硬質のプラスチックから形成されており、押圧部の裏面とパッド本体部との間には空間(S)が形成されている。
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