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1. WO2009008293 - POLISHING APPARATUS

Publication Number WO/2009/008293
Publication Date 15.01.2009
International Application No. PCT/JP2008/061932
International Filing Date 24.06.2008
IPC
H01L 21/304 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304Mechanical treatment, e.g. grinding, polishing, cutting
B24B 9/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
9Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
CPC
B24B 37/005
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
37Lapping machines or devices; Accessories
005Control means for lapping machines or devices
B24B 49/12
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
49Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
12involving optical means
B24B 9/065
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
9Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
02characterised by a special design with respect to properties of materials specific to articles to be ground
06of non-metallic inorganic material, e.g. stone, ceramics, porcelain
065of thin, brittle parts, e.g. semiconductors, wafers
Applicants
  • 株式会社 荏原製作所 EBARA CORPORATION [JP]/[JP] (AllExceptUS)
  • 金馬利文 KIMBA, Toshifumi [JP]/[JP] (UsOnly)
  • 草宏明 KUSA, Hiroaki [JP]/[JP] (UsOnly)
  • 藤井將喜 FUJII, Masaki [JP]/[JP] (UsOnly)
Inventors
  • 金馬利文 KIMBA, Toshifumi
  • 草宏明 KUSA, Hiroaki
  • 藤井將喜 FUJII, Masaki
Agents
  • 渡邉勇 WATANABE, Isamu
Priority Data
2007-18206511.07.2007JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) POLISHING APPARATUS
(FR) DISPOSITIF DE POLISSAGE
(JA) 研磨装置
Abstract
(EN)
A polishing apparatus is provided with a stage (20) for holding a substrate (W); a stage rotating mechanism (40) for rotating the stage; a polishing head (42) for polishing the peripheral section of the substrate held by the stage; a control section (70) for controlling operation of the stage (20), the stage rotating mechanism (40) and the polishing head (42); an image acquiring section (61) for acquiring an image of the peripheral section of the substrate through at least one terminal imaging section (60) arranged to face the peripheral section of the substrate; an image processing section (62) for processing the image obtained from the image acquiring section; and a liquid jetting section (51) which jets a light transmissive liquid toward the peripheral section of the substrate and fills a space between the peripheral section of the substrate and the terminal imaging section with the liquid.
(FR)
L'invention concerne un dispositif de polissage pourvu d'un étage (20) pour maintenir un substrat (W) ; d'un mécanisme de rotation d'étage (40) pour faire tourner l'étage ; d'une tête de polissage (42) pour polir la section périphérique du substrat maintenu par l'étage ; d'une section de commande (70) pour commander l'actionnement de l'étage (20), du mécanisme de rotation d'étage (40) et de la tête de polissage (42) ; d'une section d'acquisition d'image (61) pour acquérir une image de la section périphérique du substrat par l'intermédiaire d'une ou de plusieurs sections de formation d'image terminales (60) agencées pour faire face à la section périphérique du substrat ; d'une section de traitement d'image (62) pour traiter l'image obtenue par la section d'acquisition d'image ; et d'une section d'éjection de liquide (51) qui éjecte un liquide translucide vers la section périphérique du substrat et qui remplit un espace entre la section périphérique du substrat et la section de formation d'image terminale avec le liquide.
(JA)
本発明は、基板Wを保持するためのステージ(20)と、ステージを回転させるためのステージ回転機構(40)と、ステージに保持された基板の周縁部を研磨するための研磨ヘッド(42)と、ステージ(20)、ステージ回転機構(40)、および研磨ヘッド(42)の動作を制御する制御部(70)と、基板の周縁部に対向して配置された少なくとも1つの末端撮像部(60)を介して該基板の周縁部の画像を取得する画像取得部(61)と、画像取得部からの画像を処理する画像処理部(62)と、光透過性を有する液体を基板の周縁部に向けて噴射して、基板の周縁部と末端撮像部との間を液体で満たす液体噴射部(51)とを備える。
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