Processing

Please wait...

Settings

Settings

Goto Application

1. WO2009005029 - RESIN HEAT SINK

Publication Number WO/2009/005029
Publication Date 08.01.2009
International Application No. PCT/JP2008/061827
International Filing Date 30.06.2008
IPC
H05K 7/20 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
H05K 9/00 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
9Screening of apparatus or components against electric or magnetic fields
CPC
F28D 15/0233
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
15Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
02in which the medium condenses and evaporates, e.g. heat pipes
0233the conduits having a particular shape, e.g. non-circular cross-section, annular
F28F 21/06
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
21Constructions of heat-exchange apparatus characterised by the selection of particular materials
06of plastics material
F28F 3/02
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
3Plate-like or laminated elements; Assemblies of plate-like or laminated elements
02Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
H01L 23/373
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
373Cooling facilitated by selection of materials for the device ; or materials for thermal expansion adaptation, e.g. carbon
H01L 23/3737
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
373Cooling facilitated by selection of materials for the device ; or materials for thermal expansion adaptation, e.g. carbon
3737Organic materials with or without a thermoconductive filler
H01L 2924/0002
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
0001Technical content checked by a classifier
0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applicants
  • スターライト工業株式会社 STARLITE CO., LTD. [JP]/[JP] (AllExceptUS)
  • 寒川 喜光 KANKAWA, Yoshimitsu [JP]/[JP] (UsOnly)
Inventors
  • 寒川 喜光 KANKAWA, Yoshimitsu
Agents
  • 柳野 隆生 YANAGINO, Takao
Priority Data
2007-17374702.07.2007JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) RESIN HEAT SINK
(FR) DISSIPATEUR THERMIQUE EN RÉSINE
(JA) 樹脂製ヒートシンク
Abstract
(EN)
Provided is a heat sink which has excellent heat dissipation effects and is composed of a resin material having excellent electromagnetic shielding characteristics. The heat sink is composed of the resin material wherein (a) a carbon material and (b) ceramic powder and/or soft magnetic powder are uniformly dispersed. The ratio of the material (a) is 15-60 vol% and that of the material (b) is 5-40 vol%, and that of the sum of the material (a) and the material (b) is 20-80 vol% in the resin material.
(FR)
L'invention concerne un dissipateur thermique qui a d'excellents effets de dissipation thermique et est composé d'un matériau de résine ayant d'excellentes caractéristiques de blindage électromagnétique. Le dissipateur thermique est composé du matériau de résine dans lequel (a) un matériau carboné et (b) une poudre céramique et/ou une poudre faiblement magnétique sont dispersés uniformément. Le rapport du matériau (a) est de 15-60 % en volume et celui du matériau (b) est de 5-40 % en volume, et celui de la somme du matériau (a) et du matériau (b) est de 20-80 % en volume dans le matériau de résine.
(JA)
 放熱効果に優れたヒートシンクであって、電磁波遮蔽性に優れた樹脂材料からなるヒートシンクを提供することを課題とする。  樹脂材料からなるヒートシンクであって、前記樹脂材料は、樹脂中に(a)炭素材料と(b)セラミックス粉末および/または軟磁性粉末とが均一に分散されており、且つ当該樹脂材料中における(a)の割合が15~60体積%であり、(b)の割合が5~40体積%であり、(a)と(b)の総和が20~80体積%であることを特徴とする。
Latest bibliographic data on file with the International Bureau