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1. (WO2008144856) CONSTRUCTIVE DISPOSITION IN HOUSING FOR THE HEAT DISSIPATION SYSTEM AND COMPONENT INSTALLATION IN ELECTRIC-ELECTRONIC APPLIANCES
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2008/144856 International Application No.: PCT/BR2007/000129
Publication Date: 04.12.2008 International Filing Date: 30.05.2007
IPC:
H05K 7/20 (2006.01) ,H01L 23/34 (2006.01) ,F28F 7/00 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7
Constructional details common to different types of electric apparatus
20
Modifications to facilitate cooling, ventilating, or heating
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
F MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28
HEAT EXCHANGE IN GENERAL
F
DETAILS OF HEAT-EXCHANGE OR HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
7
Elements not covered by group F28F1/, F28F3/, or F28F5/121
Applicants:
MACEDO, Milton Flavio de [BR/BR]; BR (UsOnly)
TECHINVEST LTDA [BR/BR]; Rua Américo Brasiliense, 2444 1st Floor Chácara Santo Antônio CEP:04715-004, São Paulo, SP, BR (AllExceptUS)
Inventors:
MACEDO, Milton Flavio de; BR
Agent:
MOREIRA, Aguinaldo; Rua Bela Cintra, 299 - 3rd Floor CEP:01415-900 São Paulo, SP, BR
Priority Data:
Title (EN) CONSTRUCTIVE DISPOSITION IN HOUSING FOR THE HEAT DISSIPATION SYSTEM AND COMPONENT INSTALLATION IN ELECTRIC-ELECTRONIC APPLIANCES
(FR) DISPOSITIF D'AMÉNAGEMENT DANS UN CORPS POUR SYSTÈME DE DISSIPATION THERMIQUE ET INSTALLATION DE COMPOSANTS DANS DES APPAREILS ÉLECTRIQUES-ÉLECTRONIQUES
Abstract:
(EN) Constructive disposition in housing for the heat dissipation system and component installation in electric-electronic appliances, formed from a housing (7), specially developed along one of the faces (6) of the cabinet (4) for electric-electronic appliances to receive the introduction of a dissipating board (1) serving as interface between the cabinet internal and external part (4), forming a passage of thermal energy which shall conduct the heat inside out, so as to create an environment favorable to the working of the already housed electronic components, avoiding also the entrance of water, dust and other waste; and that, through a wedge boss (5) of one support incorporated vertically in the cabinet internal part (4), in a studied distance of the dissipating board (1), the semi- conductors (2) upon its introduction, shall be positioned on the printed circuit board (3) pressed, duly locked.
(FR) L'invention concerne un dispositif d'aménagement dans un corps pour un système de dissipation thermique et l'installation de composants dans des appareils électriques-électroniques. Le dispositif est constitué d'un corps (7), formé spécialement sur une des faces (6) du boîtier (4) pour que des appareils électriques-électroniques puissent recevoir une carte (1) de dissipation servant d'interface entre une partie (4) interne et externe de boîtier et qui forme un passage d'énergie thermique conduisant la chaleur de l'intérieur vers l'extérieur, afin de former un environnement favorable à l'usinage des composants électroniques déjà inclus, ce qui permet aussi d'éviter la pénétration d'eau, de poussière et d'autres corps étrangers; et ce, grâce à une protubérance (5) de calage d'un support intégré verticalement dans la partie interne (4) du boîtier, à une distance définie de la carte (1) de dissipation. Lors de l'introduction de cette protubérance, les semi-conducteurs (2) doivent être positionnés sur la carte à circuit imprimé (3) pressée, bloquée de manière appropriée.
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Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (EPO) (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, MT, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)