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1. (WO2008142916) MEASURING SYSTEM, MEASURING METHOD AND PROGRAM
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2008/142916 International Application No.: PCT/JP2008/056564
Publication Date: 27.11.2008 International Filing Date: 02.04.2008
IPC:
G01B 21/04 (2006.01) ,G01B 21/20 (2006.01) ,G03F 1/08 (2006.01) ,H01L 21/027 (2006.01) ,B29C 59/02 (2006.01)
G PHYSICS
01
MEASURING; TESTING
B
MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
21
Measuring arrangements or details thereof in so far as they are not adapted to particular types of measuring means of the other groups of this subclass
02
for measuring length, width, or thickness
04
by measuring coordinates of points
G PHYSICS
01
MEASURING; TESTING
B
MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
21
Measuring arrangements or details thereof in so far as they are not adapted to particular types of measuring means of the other groups of this subclass
20
for measuring contours or curvatures, e.g. determining profile
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
1
Originals for photomechanical production of textured or patterned surfaces, e.g. masks, photo-masks or reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
08
Originals having inorganic imaging layers, e.g. chrome masks
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
027
Making masks on semiconductor bodies for further photolithographic processing, not provided for in group H01L21/18 or H01L21/34165
B PERFORMING OPERATIONS; TRANSPORTING
29
WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
C
SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
59
Surface shaping, e.g. embossing; Apparatus therefor
02
by mechanical means, e.g. pressing
Applicants:
有塚 祐樹 ARITSUKA, Yuki; null (UsOnly)
法元 盛久 HOGA, Morihisa; null (UsOnly)
大日本印刷株式会社 DAI NIPPON PRINTING CO., LTD. [JP/JP]; 〒1628001 東京都新宿区市谷加賀町一丁目1番1号 Tokyo 1-1, Ichigaya Kagacho 1-chome, Shinjuku-ku, Tokyo 1628001, JP (AllExceptUS)
Inventors:
有塚 祐樹 ARITSUKA, Yuki; null
法元 盛久 HOGA, Morihisa; null
Agent:
三好 秀和 MIYOSHI, Hidekazu; 〒1050001 東京都港区虎ノ門一丁目2番8号 虎ノ門琴平タワー Tokyo Toranomon Kotohira Tower 2-8, Toranomon 1-chome Minato-ku, Tokyo 1050001, JP
Priority Data:
2007-13563322.05.2007JP
Title (EN) MEASURING SYSTEM, MEASURING METHOD AND PROGRAM
(FR) SYSTÈME DE MESURE, PROCÉDÉ DE MESURE ET PROGRAMME
(JA) 測定システム、測定方法及びプログラム
Abstract:
(EN) The measuring system comprises an external storage section (26) for storing the tolerance of first and second profile factors defining the design profile of a measurement object (10), a measuring instrument (14) for obtaining the measurement data of the first profile factor of the measurement object (10), a section (32) for comparing the measurement data of the first profile factor with the tolerance of the first profile factor read out from the external storage section (26), a section (34) for constituting a prediction profile from the measurement data and verifying whether it is formed as a figure or not, a section (36) for calculating the prediction data of the second profile factor from a prediction profile constituted at the verifying section (34), and a section (38) for judging the measurement profile by comparing the prediction data calculated at the calculating section (36) with the tolerance of the second profile factor read out from the external storage section (26).
(FR) L'invention concerne un système de mesure qui comprend une section de stockage externe (26) pour stocker la tolérance de premier et second facteurs de profil définissant le profil de modèle d'un objet de mesure (10), un instrument de mesure (14) pour obtenir les données de mesure du premier facteur de profil de l'objet de mesure (10), une section (32) pour comparer les données de mesure du premier facteur de profil avec la tolérance du premier facteur de profil lu à partir de la section de stockage externe (26), une section (34) pour constituer un profil de prédiction à partir des données de mesure et vérifier si ou non il est formé sous la forme d'un chiffre, une section (36) pour calculer les données de prédiction du second facteur de profil à partir d'un profil de prédiction constitué au niveau de la section de vérification (34), et une section (38) pour déterminer le profil de mesure par comparaison avec les données de prédiction calculées au niveau de la section de calcul (36) avec la tolérance du second facteur de profil lu à partir de la section de stockage externe (26).
(JA)  測定対象物(10)の設計形状を規定する第1及び第2形状因子の公差を格納する外部記憶部(26)と、測定対象物(10)の第1形状因子の測定データを得る測定器(14)と、第1形状因子の測定データと外部記憶部(26)から読み出した第1形状因子の公差とを比較する比較部(32)と、測定データから予測形状を構成して図形として成立するか検証する検証部(34)と、検証部(34)が構成した予測形状から第2形状因子の予測データを計算する計算部(36)と、計算部(36)が計算した予測データを外部記憶部(26)から読み出した第2形状因子の公差と比較して測定形状を判定する判定部(38)とを備える。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (EPO) (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)