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Machine translation
1. (WO2008103338) METHODS AND APPARATUS TO IMPROVE FRIT-SEALED GLASS PACKAGE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2008/103338    International Application No.:    PCT/US2008/002159
Publication Date: 28.08.2008 International Filing Date: 19.02.2008
IPC:
H01L 51/52 (2006.01)
Applicants: CORNING INCORPORATED [US/US]; 1 Riverfront Plaza, Corning, New York 14831 (US) (For All Designated States Except US).
CHATTERJEE, Dilip, K. [US/US]; (US) (For US Only).
NGUYEN, Kelvin [US/US]; (US) (For US Only)
Inventors: CHATTERJEE, Dilip, K.; (US).
NGUYEN, Kelvin; (US)
Agent: WATSON, Bruce, P.; Corning Incorporated, Intellectual Property Department, SP-TI-3-1, Corning, New York 14831 (US)
Priority Data:
11/710,302 23.02.2007 US
Title (EN) METHODS AND APPARATUS TO IMPROVE FRIT-SEALED GLASS PACKAGE
(FR) PROCÉDÉS ET DISPOSITIF POUR AMÉLIORER DES BOÎTIERS EN VERRE SOUDÉS À LA FRITTE
Abstract: front page image
(EN)A hermetically sealed package includes: a first plate (102) including inside and outside surfaces; a second plate (104) including inside and outside surfaces; frit material (106) disposed on the inside surface of the second plate; and at least one dielectric layer (108) disposed directly or indirectly on at least one of: (i) the inside surface of the first plate at least opposite to the frit material, and (ii) the inside surface of the second plate at least directly or indirectly on the frit material, wherein the frit material forms a hermetic seal against the dielectric layer in response to heating.
(FR)L'invention concerne un boîtier soudé hermétique qui comporte : une première plaque (102) comportant des surfaces intérieure et extérieure; une seconde plaque (104) comportant des surfaces intérieure et extérieure, un matériau de fritte (106) disposé sur la surface intérieure de la seconde plaque; et au moins une couche diélectrique (108) disposée directement ou indirectement sur: (i) la surface intérieure de la première plaque, au moins face au matériau de fritte et/ou (ii) la surface intérieure de la seconde plaque, au moins directement ou indirectement sur le matériau de fritte; le matériau de fritté formant un joint hermétique contre la couche diélectrique en réponse au chauffage.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)