WIPO logo
Mobile | Deutsch | Español | Français | 日本語 | 한국어 | Português | Русский | 中文 | العربية |
PATENTSCOPE

Search International and National Patent Collections
World Intellectual Property Organization
Search
 
Browse
 
Translate
 
Options
 
News
 
Login
 
Help
 
Machine translation
1. (WO2008102603) SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2008/102603    International Application No.:    PCT/JP2008/051153
Publication Date: 28.08.2008 International Filing Date: 28.01.2008
IPC:
H01L 21/304 (2006.01), H01L 21/677 (2006.01)
Applicants: TOKYO ELECTRON LIMITED [JP/JP]; 3-6, Akasaka 5-chome, Minato-ku, Tokyo 1078481 (JP) (For All Designated States Except US).
KAMIKAWA, Yuji [JP/JP]; (JP) (For US Only)
Inventors: KAMIKAWA, Yuji; (JP)
Agent: YOSHITAKE, Kenji; Kyowa Patent & Law Office, Room 323, Fuji Bldg., 2-3, Marunouchi 3-chome, Chiyoda-ku Tokyo 1000005 (JP)
Priority Data:
2007-043918 23.02.2007 JP
Title (EN) SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
(FR) APPAREIL DE TRAITEMENT DE SUBSTRAT ET PROCÉDÉ DE TRAITEMENT DE SUBSTRAT
(JA) 基板処理装置および基板処理方法
Abstract: front page image
(EN)A substrate processing apparatus is provided with a substrate processing container (30) having a chamber inside for storing a substrate (W) to be processed; a first transfer unit (40) which receives and transfers the substrate (W) to the substrate processing container (30); and a second transfer unit which receives and transfers the substrate (W) to the first transfer unit (40) and receives the substrate (W) from the first transfer unit (40). The first transfer unit (40) is of noncontact type and holds the substrate (W) from above without being in contact with the upper surface of the substrate (W). The second transfer unit is of contact type and holds the substrate (W) by being in contact with the substrate (W).
(FR)L'invention concerne un appareil de traitement de substrat comportant un conteneur de traitement de substrat (30) ayant une chambre à l'intérieur pour stocker un substrat (W) devant être traité ; une première unité de transfert (40) qui reçoit et transfère le substrat (W) au conteneur de traitement de substrat (30) ; et une seconde unité de transfert qui reçoit et transfère le substrat (W) à la première unité de transfert (40) et reçoit le substrat (W) à partir de la première unité de transfert (40). La première unité de transfert (40) est d'un type sans contact et maintient le substrat (W) du dessus sans être en contact avec la surface supérieure du substrat (W). La seconde unité de transfert est d'un type à contact et maintient le substrat (W) en contact avec le substrat (W).
(JA) 基板処理装置は、被処理基板(W)が収容されるチャンバーを内部に有する基板処理容器(30)と、基板処理容器(30)に対して被処理基板Wの受け渡しを行う第1搬送ユニット(40)と、第1搬送ユニット(40)への被処理基板(W)の受け渡しおよび第1搬送ユニット(40)からの被処理基板(W)の受け取りを行う第2搬送ユニットとを備えている。第1搬送ユニット(40)は、被処理基板(W)の上面に接触することなく当該被処理基板(W)を上方から保持する非接触式のものである。第2搬送ユニットは、被処理基板(W)に接触することにより当該被処理基板(W)を保持する接触式のものである。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)