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1. (WO2008101740) DEVICE AND METHOD FOR THE ELECTROLYTIC PLATING OF METAL
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2008/101740    International Application No.:    PCT/EP2008/001621
Publication Date: 28.08.2008 International Filing Date: 20.02.2008
IPC:
C25D 17/00 (2006.01), C25D 17/02 (2006.01), C25D 17/12 (2006.01), C25D 21/12 (2006.01)
Applicants: ATOTECH DEUTSCHLAND GmbH [DE/DE]; Erasmusstrasse 20, 10553 Berlin (DE) (For All Designated States Except US).
MATEJAT, Kai-Jens [DE/DE]; (DE) (For US Only).
LAMPRECHT, Sven [DE/DE]; (DE) (For US Only).
BANGERTER, Timo [DE/DE]; (DE) (For US Only).
REENTS, Bert [DE/DE]; (DE) (For US Only)
Inventors: MATEJAT, Kai-Jens; (DE).
LAMPRECHT, Sven; (DE).
BANGERTER, Timo; (DE).
REENTS, Bert; (DE)
Agent: BRESSEL UND PARTNER; Radickestrasse 48, 12489 Berlin (DE)
Priority Data:
07090029.5 22.02.2007 EP
Title (EN) DEVICE AND METHOD FOR THE ELECTROLYTIC PLATING OF METAL
(FR) DISPOSITIF ET MÉTHODE DE PLAQUAGE ÉLECTROLYTIQUE DE MÉTAUX
Abstract: front page image
(EN)To achieve uniform electroplating of a metal on a work piece a device is provided, which comprises at least one anode and a diaphragm comprising a fill made of packing material. The diaphragm is located in the device such that electric field lines extending between the at least one anode and the work piece placed in the device at least partially traverse the diaphragm.
(FR)L'invention porte sur un dispositif assurant un plaquage électrolytique uniforme de métaux sur une pièce à traiter, comprenant : au moins une anode, ainsi qu'une membrane comprenant une charge de matériau de remplissage, et disposée sur le dispositif de manière à ce que les lignes de champ électrique s'étendant de la ou des anodes à la pièce à traiter traversent au moins en partie la membrane.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)