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1. (WO2008101416) THE APPLICATION OF THE EPOXY-ALN COMPOSITE MATERIAL IN THE PREPARATION OF THE HIGH DENSITY PCB
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2008/101416    International Application No.:    PCT/CN2008/000360
Publication Date: 28.08.2008 International Filing Date: 18.02.2008
Chapter 2 Demand Filed:    16.12.2008    
IPC:
H05K 1/03 (2006.01), B32B 15/092 (2006.01), C01B 21/072 (2006.01)
Applicants: The Hong Kong Polytechnic University [CN/CN]; Hung Hom Kowloon, Hong Kong (CN) (For All Designated States Except US).
YUNG, Winco, Kam-Chuen [CN/CN]; (CN) (For US Only).
WU, Jun [CN/CN]; (CN) (For US Only).
YUE, Tai Man [CN/CN]; (CN) (For US Only)
Inventors: YUNG, Winco, Kam-Chuen; (CN).
WU, Jun; (CN).
YUE, Tai Man; (CN)
Agent: LUNG TIN INTERNATIONAL INTELLECTUAL PROPERTY AGENTLTD.; 18th Floor, Tower B, Grand Place No.5 Huizhong Road Chaoyang District Beijing 100101 (CN)
Priority Data:
200710084130.8 16.02.2007 CN
Title (EN) THE APPLICATION OF THE EPOXY-ALN COMPOSITE MATERIAL IN THE PREPARATION OF THE HIGH DENSITY PCB
(FR) APPLICATION DU MATÉRIAU COMPOSITE D'ÉPOXY-ALN DANS LA PRÉPARATION DU BPC À HAUTE DENSITÉ
(ZH) 环氧树脂-氮化铝复合材料在制备高密度印刷线路板中的应用
Abstract: front page image
(EN)An application of the epoxy-AlN composite material in the preparation of the high density PCB. The epoxy-AlN composite material is manufactured by the following process: pre-treating the surface of the AlN powder by a coupling agent; adding a solvent to the AlN powder, then stirring the obtained solution with an ultrasonic agitator; mixing the AlN solution and the epoxy system so sufficient as to obtain a uniform dispersant; injecting the dispersant into a mould, then drying it in vacuum. The grain diameter of the AlN powder is 10nm-50μm, and the weight of the AlN powder is 5-70 wt% of the weight of the composite material .
(FR)La présente invention concerne l'application du matériau composite de l'époxy-AlN dans la préparation du BPC à haute densité. Le matériau composite d'époxy-AlN est fabriqué par le processus consistant à : prétraiter la surface de la poudre d'AlN à l'aide d'un agent de couplage ; ajouter un solvant à la poudre d'AlN puis agiter la solution obtenue à l'aide d'un agitateur ultrasonique ; mélanger la solution d'AlN et le système d'époxy suffisamment pour obtenir un dispersant uniforme ; injecter le dispersant dans un moule puis le faire sécher sous vide. Le diamètre de grain de la poudre d'AlN est de 10 nm à 50 µm, et le poids de la poudre d'AlN représente de 5 à 70 % en poids du poids du matériau composite.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)