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Pub. No.:    WO/2008/099934    International Application No.:    PCT/JP2008/052572
Publication Date: 21.08.2008 International Filing Date: 15.02.2008
H01L 23/373 (2006.01)
Applicants: KABUSHIKI KAISHA TOSHIBA [JP/JP]; 1-1, Shibaura 1-chome, Minato-ku, Tokyo 1058001 (JP) (For All Designated States Except US).
HASEGAWA, Tsuyoshi [JP/JP]; (For US Only)
Inventors: HASEGAWA, Tsuyoshi;
Agent: SUZUYE, Takehiko; c/o SUZUYE & SUZUYE 1-12-9, Toranomon Minato-ku, Tokyo 1050001 (JP)
Priority Data:
2007-035356 15.02.2007 JP
2008-029614 08.02.2008 JP
(JA) 半導体パッケージ
Abstract: front page image
(EN)Provided is a semiconductor package wherein a semiconductor element is arranged on one surface of a base section. The base section is configured by adhering a plurality of thin plates (52, 54, 56, 58) each other and integrally bonding them. A high heat transfer element (70), which is composed of particles made of a material having heat transfer efficiency higher than that of the base section, is dispersed between two thin plates adjacent to each other among the thin plates.
(FR)L'invention propose un boîtier de semi-conducteur dans lequel un élément de semi-conducteur (16) est agencé sur une surface d'une section de base (10). La section de base est configurée en collant une pluralité de plaques minces (52, 54, 56, 58) ensemble et en les liant de manière solidaire. Un élément de transfert thermique élevé (70), qui est composé de particules constituées d'un matériau ayant une efficacité de transfert thermique supérieure à celle de la section de base, est dispersé entre deux plaques minces adjacentes l'une à l'autre parmi les plaques minces.
(JA) 本発明は、ベース部の一表面に半導体素子が設けられた半導体パッケージに関するものであり、前記ベース部が複数枚の薄板(52,54,56,58)を相互に密着させて一体的に接合することにより構成されており、前記複数枚の薄板のうち、相互に隣接した2枚の間に、前記ベース部よりも高い熱伝達効率を有する材料により構成された粒体からなる高熱伝達要素(70)が分散されている。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)