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Machine translation
1. (WO2008099933) SEMICONDUCTOR PACKAGE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2008/099933    International Application No.:    PCT/JP2008/052571
Publication Date: 21.08.2008 International Filing Date: 15.02.2008
IPC:
H01L 23/427 (2006.01)
Applicants: KABUSHIKI KAISHA TOSHIBA [JP/JP]; 1-1, Shibaura 1-chome, Minato-ku, Tokyo 1058001 (JP) (For All Designated States Except US).
HASEGAWA, Tsuyoshi [JP/JP]; (For US Only)
Inventors: HASEGAWA, Tsuyoshi;
Agent: SUZUYE, Takehiko; c/o SUZUYE & SUZUYE 1-12-9, Toranomon Minato-ku, Tokyo 1050001 (JP)
Priority Data:
2007-035356 15.02.2007 JP
Title (EN) SEMICONDUCTOR PACKAGE
(FR) BOÎTIER DE SEMI-CONDUCTEUR
(JA) 半導体パッケージ
Abstract: front page image
(EN)Provided is a semiconductor package wherein a semiconductor element (16) is arranged on one surface of a base section (10). The base section is configured by adhering a plurality of thin plates (12, 14) each other and integrally bonding them. At least one heat pipe (36), which is arranged to extend to an external position from a position that corresponds to a heat generating portion, is included in the base section.
(FR)L'invention propose un boîtier de semi-conducteur dans lequel un élément de semi-conducteur (16) est agencé sur une surface d'une section de base (10). La section de base est configurée en collant une pluralité de plaques minces (12, 14) ensemble et en les liant de manière solidaire. Au moins un caloduc (36) agencé pour s'étendre vers une position externe à partir d'une position qui correspond à une partie de génération de chaleur, est inclus dans la section de base.
(JA) 本発明は、ベース部(10)の一表面に半導体素子(16)が設けられた半導体パッケージに関し、前記ベース部が複数枚の薄板(12,14)を相互に密着させて一体的に接合することにより構成されており、前記ベース部中に発熱部位対応位置から外側の位置まで延出して配置されているヒートパイプ(36)が少なくとも1つ含まれていることを特徴とする。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)