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1. (WO2008097996) BEVEL CLEAN DEVICE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2008/097996    International Application No.:    PCT/US2008/053081
Publication Date: 14.08.2008 International Filing Date: 05.02.2008
H01L 21/3065 (2006.01)
Applicants: LAM RESEARCH CORPORATION [US/US]; 4650 Cushing Parkway, Fremont, California 94538 (US) (For All Designated States Except US).
KIM, Yunsang [KR/US]; (US) (For US Only).
BAILEY, Andrew, III [US/US]; (US) (For US Only).
SEXTON, Greg [US/US]; (US) (For US Only).
KIM, Keechan [KR/US]; (US) (For US Only).
KUTHI, Andras [US/US]; (US) (For US Only)
Inventors: KIM, Yunsang; (US).
BAILEY, Andrew, III; (US).
SEXTON, Greg; (US).
KIM, Keechan; (US).
KUTHI, Andras; (US)
Agent: LEE, Michael, B., K.; Beyer Law Group LLP, P.O. Box 1687, Cupertino, CA 95015-1687 (US)
Priority Data:
11/672,922 08.02.2007 US
Abstract: front page image
(EN)An apparatus for removing material on a bevel of a wafer is provided. A wafer support with a diameter that is less than the diameter of the wafer, wherein the wafer support is on a first side of the wafer, and wherein an outer edge of the wafer extends beyond the wafer support around the wafer is provided. An RF power source is electrically connected to the wafer. A central cover is spaced apart from the wafer support. A first electrically conductive ring is on the first side of and spaced apart from the wafer. A second electrically conductive ring is spaced apart from the wafer. An electrically conductive liner surrounds the outer edge of the wafer. A switch is between the liner and ground, allowing the liner to be switched from being grounded to floating.
(FR)L'invention concerne un appareil destiné à enlever un matériau sur un biseau d'une tranche. Un support de tranche ayant un diamètre qui est inférieur au diamètre de la tranche, où le support de tranche se trouve sur un premier côté de la tranche, et où un bord externe de la tranche s'étend au-delà du support de tranche autour de la tranche est fourni. Un bloc d'alimentation RF est connecté électriquement à la tranche. Un couvercle central est espacé du support de tranche. Un premier anneau électriquement conducteur se trouve sur le premier côté et est espacé de la tranche. Un second anneau électriquement conducteur est espacé de la tranche. Un séparateur électriquement conducteur entoure le bord externe de la tranche. Un commutateur se trouve entre le séparateur et la masse, permettant au séparateur d'être commuté de « mise à la terre » à « floating ».
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)