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1. (WO2008097370) METHOD FOR HIGH THROUGHPUT, HIGH VOLUME MANUFACTURING OF BIOMOLECULE MICRO ARRAYS
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2008/097370    International Application No.:    PCT/US2007/079748
Publication Date: 14.08.2008 International Filing Date: 27.09.2007
IPC:
C12N 15/09 (2006.01), C12M 1/00 (2006.01), C12Q 1/68 (2006.01), G01N 33/543 (2006.01)
Applicants: INTEL CORPORATION [US/US]; 2200 Mission College Boulevard, Santa Clara, California 95052 (US) (For All Designated States Except US).
SUNDARARAJAN, Narayan [IN/US]; (US) (For US Only).
RAJASEKARAN, John J. [US/US]; (US) (For US Only).
XU, Guangyu [CN/US]; (US) (For US Only).
TIWARI, Gunjan [IN/US]; (US) (For US Only).
CABEZAS, Edelmira [US/US]; (US) (For US Only)
Inventors: SUNDARARAJAN, Narayan; (US).
RAJASEKARAN, John J.; (US).
XU, Guangyu; (US).
TIWARI, Gunjan; (US).
CABEZAS, Edelmira; (US)
Agent: DAVE, Raj; Darby & Darby P. C., 1500 K Street, N. W., Suite 250, Washington, District Of Columbia 20005-1714 (US)
Priority Data:
11/529,573 29.09.2006 US
Title (EN) METHOD FOR HIGH THROUGHPUT, HIGH VOLUME MANUFACTURING OF BIOMOLECULE MICRO ARRAYS
(FR) PROCÉDÉ DE FABRICATION À HAUT DÉBIT ET GRAND VOLUME DE MICRORÉSEAUX DE BIOMOLÉCULES
Abstract: front page image
(EN)The embodiments of the invention relate to a system and method for making a biomolecule microarray comprising a spacer attachment module adapted to attach a linker to a substrate surface of the biomolecule microarray, a coupling module adapted to couple a molecule to the linker, the molecule being capable of forming a peptide bond and containing a protecting group that prevents the formation of the peptide bond, and a deprotection module adapted to create deprotection of the protecting group with a radiation exposure of about 1 - 50 mJ/cm2.
(FR)Des modes de réalisation de l'invention concernent un système et un procédé de fabrication d'un microréseau de biomolécules comprenant. un module de fixation d'espaceur apte à fixer un lieur sur la surface d'un substrat du microréseau de biomolécules; un module de couplage apte à coupler une molécule au lieur, la molécule étant capable de former une liaison peptide et pouvant contenir un groupe protecteur qui empêche la formation de la liaison peptide; et un module de déprotection apte à créer une déprotection du groupe protecteur par une exposition à rayonnement d'environ 1 à 50 mJ/cm2.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, MT, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)