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Pub. No.:    WO/2008/096611    International Application No.:    PCT/JP2008/050986
Publication Date: 14.08.2008 International Filing Date: 24.01.2008
C09J 7/02 (2006.01), C09J 11/04 (2006.01), C09J 183/04 (2006.01), H01L 21/56 (2006.01), H01L 23/50 (2006.01)
Applicants: NITTO DENKO CORPORATION [JP/JP]; 1-1-2, Shimohozumi, Ibaraki-shi, Osaka 5678680 (JP) (For All Designated States Except US).
SUGO, Yuki [JP/JP]; (JP) (For US Only).
TERADA, Yoshio [JP/JP]; (JP) (For US Only).
KONDOU, Hiroyuki [JP/JP]; (JP) (For US Only).
TAKANO, Hitoshi [JP/JP]; (JP) (For US Only)
Inventors: SUGO, Yuki; (JP).
TERADA, Yoshio; (JP).
KONDOU, Hiroyuki; (JP).
TAKANO, Hitoshi; (JP)
Agent: MOMII, Takafumi; 7th Floor, Chiyoda Building Bekkan, 6-1-2, Nishitemma, Kita-ku, Osaka-shi, Osaka 5300047 (JP)
Priority Data:
2007-027481 07.02.2007 JP
(JA) 感圧性粘着テープ
Abstract: front page image
(EN)Disclosed is a pressure-sensitive adhesive tape which enables to adequately prevent resin leakage during a sealing process in production of a semiconductor device using a metal lead frame. In this pressure-sensitive adhesive tape, the storage modulus of an adhesive layer is controlled within an adequate range. Specifically disclosed is a pressure-sensitive adhesive tape having an adhesive layer on a base sheet, wherein the adhesive layer contains a silicone adhesive composition and a lipophilic layered clay mineral dispersed in the silicone adhesive composition.
(FR)La présente invention concerne un ruban adhésif autocollant qui permet d'empêcher de façon adéquate une fuite de résine pendant un processus de fermeture hermétique dans la production d'un dispositif semi-conducteur en utilisant une grille de connexion métallique. Dans ce ruban adhésif autocollant, le module de conservation d'une couche adhésive est contrôlé dans un intervalle approprié. L'invention concerne spécifiquement un ruban adhésif autocollant ayant une couche adhésive sur une feuille de base, la couche adhésive contenant une composition adhésive de silicone et un minéral argileux stratifié lipophile dispersé dans la composition adhésive de silicone.
(JA) 粘着剤層の貯蔵弾性率が適切な範囲の値にコントロールされ、金属製のリードフレームを用いる半導体装置の製造における封止工程での樹脂漏れを好適に防止することが可能な、感圧性粘着テープを提供する。  本発明の感圧性粘着テープは、シリコーン系粘着剤組成物と該シリコーン系粘着剤組成物中に分散した親油性の層状粘土鉱物を含む粘着剤層を基材シート上に有する。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)