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Machine translation
1. (WO2008095337) A METHOD OF MANUFACTURING A MUTUAL CONNECTION STRUCTURE BETWEEN MULTI-LAYER BASEBOARDS AND STRUCTURE THEREOF
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2008/095337    International Application No.:    PCT/CN2007/000378
Publication Date: 14.08.2008 International Filing Date: 05.02.2007
IPC:
H05K 3/36 (2006.01), H05K 1/14 (2006.01), H05K 3/46 (2006.01), H01L 23/48 (2006.01), H01L 23/12 (2006.01), H01L 23/50 (2006.01)
Applicants: PRINCO CORP. [CN/CN]; No. 6 Creation 4th Road Hsinchu Science-Based Industry Park Hsinchu 300 Taiwan (CN) (For All Designated States Except US)
Inventors: YANG, Chihkuang; (CN)
Agent: ESSEN PATENT AGENCY (SHANGHAI); No. 36, Wuning Road Shanghai 200063 (CN)
Priority Data:
Title (EN) A METHOD OF MANUFACTURING A MUTUAL CONNECTION STRUCTURE BETWEEN MULTI-LAYER BASEBOARDS AND STRUCTURE THEREOF
(FR) PROCÉDÉ POUR LA FABRICATION D'UNE STRUCTURE D'ASSEMBLAGE COMMUNE ENTRE DES PANNEAUX MULTICOUCHE ET STRUCTURE ASSOCIÉE
(ZH) 多层基板间交互连结结构的制造方法及其交互连结结构
Abstract: front page image
(EN)A method of manufacturing a mutual connection structure between multi-layer baseboards includes following steps: separating at least the end of a dielectric layer and a corresponding metal layer of each multi-layer baseboard from the end of other dielectric layer and corresponding metal layer; and, adhering at least one of the end of the separated dielectric layer of one multi-layer baseboard to the separated end of a metal layer of another multi-layer baseboard so as to obtain a mutual connection structure between the multi-layer baseboards. The mutual connection structure includes at least a first multi-layer baseboard (300) and a second multi-layer baseboard (400). At least one first metal layer (12,15,18) of the first baseboard adheres to each other with a second metal layer (22 25 28) of the second baseboard to form a connection portion between the two multi-layer baseboards.
(FR)Un procédé de fabrication d'une structure d'assemblage commune entre des panneaux multicouche consiste à séparer au moins l'extrémité d'une couche diélectrique et une couche de métal correspondante de chaque panneau multicouche de l'extrémité d'une autre couche diélectrique et d'une couche de métal correspondante et à coller au moins l'extrémité de la couche diélectrique séparée d'un panneau multicouche sur l'extrémité séparée d'une couche de métal de l'autre panneau multicouche afin d'obtenir une structure d'assemblage commune entre les panneaux multicouche. La structure d'assemblage commune comprend au moins un premier panneau multicouche (300) et un second panneau multicouche (400). Au moins une première couche de métal (12, 15, 18) du premier panneau est collée à une seconde couche de métal (22, 25, 28) du second panneau de manière à former une partie d'assemblage entre les deux panneaux multicouche.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)