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Machine translation
1. (WO2008094702) METHOD OF POLISHING A TUNGSTEN-CONTAINING SUBSTRATE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2008/094702    International Application No.:    PCT/US2008/001413
Publication Date: 07.08.2008 International Filing Date: 31.01.2008
IPC:
C09K 3/14 (2006.01)
Applicants: CABOT MICROELECTRONICS CORPORATION [US/US]; Legal Department, 870 North Commons Drive, Aurora, Illinois 60504 (US)
Inventors: VACASSY, Robert; (US).
KHANNA, Dinesh; (US).
SIMPSON, Alexander; (US)
Agent: WESEMAN, Steven; Associate General Counsel, Intellectual Property, Cabot Microelectronics Corporation, 870 North Commons Drive, Aurora, Illinois 60504 (US)
Priority Data:
11/670,137 01.02.2007 US
Title (EN) METHOD OF POLISHING A TUNGSTEN-CONTAINING SUBSTRATE
(FR) PROCÉDÉ DE POLISSAGE D'UN SUBSTRAT CONTENANT DU TUNGSTÈNE
Abstract: front page image
(EN)The invention provides a method of chemically-mechanically polishing a substrate comprising tungsten through use of a composition comprising a tungsten etchant, an inhibitor of tungsten etching, and water, wherein the inhibitor of tungsten polishing is a polymer, copolymer, or polymer blend comprising at least one repeating group comprising at least one nitrogen-containing heterocyclic ring or a tertiary or quaternary nitrogen atom. The invention further provides a chemical-mechanical polishing composition particularly useful in polishing tungsten-containing substrates.
(FR)L'invention concerne un procédé de polissage chimique - mécanique d'un substrat comprenant du tungstène en utilisant une composition comprenant un agent d'attaque du tungstène, un inhibiteur de l'attaque du tungstène et de l'eau, l'inhibiteur du polissage du tungstène étant un polymère, un copolymère ou un mélange de polymères comprenant au moins un groupe répétitif comprenant au moins un cycle hétérocyclique contenant de l'azote ou un atome tertiaire ou quaternaire. L'invention concerne en outre la composition de polissage chimique - mécanique particulièrement utile dans le polissage des substrats contenant du tungstène.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)