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Machine translation
1. (WO2008094669) INCREASING RELIABILITY OF COPPER-BASED METALLIZATION STRUCTURES IN A MICROSTRUCTURE DEVICE BY USING ALUMINUM NITRIDE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2008/094669    International Application No.:    PCT/US2008/001316
Publication Date: 07.08.2008 International Filing Date: 31.01.2008
IPC:
H01L 21/768 (2006.01), H01L 21/314 (2006.01)
Applicants: ADVANCED MICRO DEVICES, INC. [US/US]; One Amd Place, Mail Stop 68, P.O. Box 3453, Sunnyvale, CA 94088-3453 (US) (For All Designated States Except US).
STRECK, Christof [DE/DE]; (DE) (For US Only).
KAHLERT, Volker [DE/DE]; (DE) (For US Only)
Inventors: STRECK, Christof; (DE).
KAHLERT, Volker; (DE)
Agent: DRAKE, Paul, S.; Advanced Micro Devices, Inc., 5204 East Ben White Boulevard, Mail Stop 562, Austin, TX 78741 (US)
Priority Data:
10 2007 004 867.1 31.01.2007 DE
11/948,245 30.11.2007 US
Title (EN) INCREASING RELIABILITY OF COPPER-BASED METALLIZATION STRUCTURES IN A MICROSTRUCTURE DEVICE BY USING ALUMINUM NITRIDE
(FR) AUGMENTATION DE FIABILITÉ DE STRUCTURES DE MÉTALLISATION À BASE DE CUIVRE DANS UN DISPOSITIF À MICROSTRUCTURE EN UTILISANT DU NITRURE D'ALUMINIUM
Abstract: front page image
(EN)By forming an aluminum nitride layer (106) by a self-limiting process sequence, the interface characteristics of a copper-based metallization layer may be significantly enhanced while nevertheless maintaining the overall permittivity of the layer stack at a lower level.
(FR)L'invention concerne la formation d'une couche de nitrure d'aluminium (106) par une séquence de procédé auto-modératrice, les caractéristiques d'interface d'une couche de métallisation à base de cuivre pouvant être significativement améliorées tout en maintenant néanmoins la permittivité globale de la pile de couche à un niveau inférieur.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)