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Pub. No.:    WO/2008/093090    International Application No.:    PCT/GB2008/000324
Publication Date: 07.08.2008 International Filing Date: 31.01.2008
H01L 51/00 (2006.01)
Applicants: IMPERIAL INNOVATIONS LIMITED [GB/GB]; Electrical and Electronic Engineering Building, Level 12, Imperial College, Exhibition Road, London SW7 2AZ (GB) (For All Designated States Except US).
BRADLEY, Donal [GB/GB]; (GB) (For US Only).
CHEN, Lichun [SE/GB]; (GB) (For US Only).
DEGENAAR, Patrick [NL/GB]; (GB) (For US Only)
Inventors: BRADLEY, Donal; (GB).
CHEN, Lichun; (GB).
DEGENAAR, Patrick; (GB)
Agent: REES, David, Christopher; Kilburn & Strode, 20 Red Lion Street, London WC1R 4PJ (GB)
Priority Data:
0701909.4 31.01.2007 GB
Abstract: front page image
(EN)A method for depositing one or more organic layers onto a substrate (1), which comprises; transferring the said layer or layers from a depositing surface of a stamp (5) to the substrate by bringing the layer coated depositing surface of the stamp into contact with the substrate, and the use of either or both of the steps of (i) contacting the polymer with a plasticizer (2) and (ii) heating the substrate and/or stamp, in order to create favourable conditions for conformal contact and uniform layer transfer.
(FR)L'invention concerne un procédé pour le dépôt d'une ou plusieurs couches organiques sur un substrat, qui consiste à : transférer la ou lesdites couches depuis une surface de dépôt d'un timbre sur le substrat en amenant la surface de dépôt revêtue de la couche du timbre au contact du substrat, et à utiliser l'une ou les deux étapes qui consistent à (i) mettre le polymère en contact avec un agent plastifiant et (ii) faire chauffer le substrat et/ou le timbre afin de créer les conditions favorables pour un contact conformé et le transfert d'une couche uniforme.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)