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1. WO2008047888 - METHOD FOR FORMING SOLDER LAYER ON PRINTED-WIRING BOARD AND SLURRY DISCHARGE DEVICE

Publication Number WO/2008/047888
Publication Date 24.04.2008
International Application No. PCT/JP2007/070395
International Filing Date 12.10.2007
IPC
H05K 3/34 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
30Assembling printed circuits with electric components, e.g. with resistor
32electrically connecting electric components or wires to printed circuits
34by soldering
H05K 3/24 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
22Secondary treatment of printed circuits
24Reinforcing of the conductive pattern
CPC
B23K 2101/42
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
2101Articles made by soldering, welding or cutting
36Electric or electronic devices
42Printed circuits
B23K 3/0638
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
3Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
06Solder feeding devices; Solder melting pans
0607Solder feeding devices
0638for viscous material feeding, e.g. solder paste feeding
H05K 2203/0126
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2203Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
01Tools for processing; Objects used during processing
0104for patterning or coating
0126Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
H05K 2203/124
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2203Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
12Using specific substances
122Organic non-polymeric compounds, e.g. oil, wax, thiol
124Heterocyclic organic compounds, e.g. azole, furan
H05K 3/3485
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
30Assembling printed circuits with electric components, e.g. with resistor
32electrically connecting electric components or wires to printed circuits
34by soldering
3457Solder materials or compositions; Methods of application thereof
3485Applying solder paste, slurry or powder
Applicants
  • SHOWA DENKO K.K. [JP]/[JP] (AllExceptUS)
  • SHOJI, Takashi [JP]/[JP] (UsOnly)
  • SAKAI, Takekazu [JP]/[JP] (UsOnly)
Inventors
  • SHOJI, Takashi
  • SAKAI, Takekazu
Agents
  • FUKUDA, Kenzo
Priority Data
2006-28232817.10.2006JP
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) METHOD FOR FORMING SOLDER LAYER ON PRINTED-WIRING BOARD AND SLURRY DISCHARGE DEVICE
(FR) Procédé permettant de former une couche de brasure tendre sur une carte de câblage imprimé et dispositif de décharge de boue
Abstract
(EN)
A method for forming a solder layer on the surface of a conductive circuit on a printed-wiring board includes discharging slurry containing solder powder onto the surface and heating the substrate. The slurry is discharged by dint of the pressure in a tank for the slurry. In a discharging device to be used in the method, the tank for storing the slurry is provided with a discharge pipe (2) for the slurry and a delivery pipe (1) for gas or solvent to be used for adjusting the pressure in the tank. In this device, one common pipe may be used both for discharging the slurry from the tank and delivering the slurry to the tank and one common pipe may be used for both delivering gas into the tank and sucking the gas from the tank.
(FR)
Le procédé selon l'invention permet de former une couche de brasure tendre sur la surface d'un circuit conducteur sur une carte de câblage imprimé et inclut la décharge de la boue contenant de la poudre de brasure tendre sur la surface et le chauffage du substrat. La boue est déchargée en agissant sur la pression dans une cuve destinée à recevoir la boue. Dans un dispositif de décharge devant être utilisé dans le procédé, la cuve destinée à stocker la boue est dotée d'un tuyau de refoulement (2) pour la boue et d'un tuyau d'alimentation (1) pour un gaz ou un solvant devant être utilisé pour ajuster la pression dans la cuve. Dans ce dispositif, un tuyau commun peut être utilisé à la fois pour décharger la boue à partir de la cuve et amener la boue jusqu'à la cuve et un tuyau commun peut être utilisé à la fois pour amener le gaz jusque dans la cuve et aspirer le gaz en dehors de la cuve.
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