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1. WO2008047716 - DISPLAY DEVICE

Publication Number WO/2008/047716
Publication Date 24.04.2008
International Application No. PCT/JP2007/069974
International Filing Date 12.10.2007
IPC
H05B 33/04 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
BELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33Electroluminescent light sources
02Details
04Sealing arrangements
G09F 9/30 2006.01
GPHYSICS
09EDUCATING; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
9Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
30in which the desired character or characters are formed by combining individual elements
H01L 27/32 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
H01L 51/50 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
CPC
H01L 27/3276
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
3241Matrix-type displays
3244Active matrix displays
3276Wiring lines
H01L 51/5259
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
52Details of devices
5237Passivation; Containers; Encapsulation, e.g. against humidity
5259including getter material or desiccant
H05B 33/04
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
BELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33Electroluminescent light sources
02Details
04Sealing arrangements ; , e.g. against humidity
Applicants
  • 東芝松下ディスプレイテクノロジー株式会社 Toshiba Matsushita Display Technology Co., Ltd. [JP]/[JP] (AllExceptUS)
  • 炭田 祉朗 SUMITA, Shiro [JP]/[JP] (UsOnly)
  • 佐野 浩 SANO, Hiroshi [JP]/[JP] (UsOnly)
Inventors
  • 炭田 祉朗 SUMITA, Shiro
  • 佐野 浩 SANO, Hiroshi
Agents
  • 鈴江 武彦 SUZUYE, Takehiko
Priority Data
2006-28421518.10.2006JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) DISPLAY DEVICE
(FR) DISPOSITIF D'AFFICHAGE
(JA) 表示装置
Abstract
(EN)
A display device is provided with an array substrate (100), a sealing substrate (200) and a sealing material (400). The array substrate is provided with a top emission type display element (40) arranged in a rectangular display area (101); and a driving circuit (700) arranged outside the display area for driving the display element. The sealing substrate is arranged to face the display element of the array substrate with a recessed section (210) which faces the display element and is larger than the display area. The sealing material is arranged to surround the display area and at least a part of the driving circuit, for bonding between the array substrate and the sealing substrate. Furthermore, the sealing substrate is provided with a moisture absorbing material (500) arranged outside the display area of the recessed section, along three or less sides among the four sides of the display area. The moisture absorbing material and the driving circuit are arranged with at least their parts overlapping each other.
(FR)
La présente invention concerne un dispositif d'affichage qui est muni d'un substrat matriciel (100), d'un substrat d'étanchéité (200) et d'un matériau d'étanchéité (400). Le substrat matriciel est muni d'un élément d'affichage de type à émission par le haut (40) disposé dans une zone d'affichage rectangulaire (101) ; et d'un circuit de commande (700) disposé à l'extérieur de la zone d'affichage pour commander l'élément d'affichage. Le substrat d'étanchéité est disposé afin d'être en face de l'élément d'affichage du substrat matriciel avec une section en retrait (210) qui est en face de l'élément d'affichage et est plus grande que la zone d'affichage. Le matériau d'étanchéité est disposé afin d'entourer la zone d'affichage et au moins une partie du circuit de commande, pour le collage entre le substrat matriciel et le substrat d'étanchéité. En outre, le substrat d'étanchéité est muni d'un matériau d'absorption d'humidité (500) disposé à l'extérieur de la zone d'affichage de la section en retrait, le long de trois ou moins côtés parmi les quatre côtés de la zone d'affichage. Le matériau d'absorption d'humidité et le circuit de commande sont disposés avec leurs parties au moins qui se chevauchent.
(JA)
 矩形状の表示エリア(101)に備えられたトップエミッションタイプの表示素子(40)と、表示エリア外に配置され表示素子を駆動する駆動回路(700)と、を備えたアレイ基板100と、アレイ基板の表示素子に対向するように配置され、表示素子に対向するとともに表示エリアより大きな凹部(210)を有する封止基板(200)と、表示エリア及び少なくとも一部の駆動回路を囲むように配置され、アレイ基板と封止基板とを貼り合わせるシール材(400)と、を備え、封止基板は、さらに、凹部の表示エリア外において、表示エリアの4つの辺のうちの3以下の辺に沿って配置された吸湿材料(500)を備え、 吸湿材料と駆動回路とは、互いにそれぞれの少なくとも一部が重畳するように配置されたことを特徴とする。
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