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1. (WO2008042482) DISPOSABLE, HIGH PRESSURE MICROFLUIDIC CHIPS
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2008/042482 International Application No.: PCT/US2007/071607
Publication Date: 10.04.2008 International Filing Date: 19.06.2007
IPC:
B29C 65/00 (2006.01) ,B32B 37/00 (2006.01) ,H05K 13/04 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
29
WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
C
SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
65
Joining of preformed parts; Apparatus therefor
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
37
Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13
Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
04
Mounting of components
Applicants:
THE REGENTS OF THE UNIVERSITY OF CALIFORNIA [US/US]; 1111 Franklin Street 12th Floor Oakland, CA 94607-5200, US (AllExceptUS)
MAIR, Dieudonne [US/US]; US (UsOnly)
Inventors:
MAIR, Dieudonne; US
Agent:
CARON, R'Sue ; Lawrence Berkeley National Laboratory One Cyclotron Road, MS 90B-0104 Berkeley, CA 94720, US
Priority Data:
60/805,15519.06.2006US
Title (EN) DISPOSABLE, HIGH PRESSURE MICROFLUIDIC CHIPS
(FR) PUCES MICROFLUIDIQUES HAUTE PRESSION JETABLES
Abstract:
(EN) An injection molding process for the fabrication of disposable unitary plastic microfluidic chips with a cycle time on the order of minutes is described. The microfluidic chips feature novel, integrated, reversible, standardized, ready-to-use interconnects that enable operation at pressures not before realized with microfluidic chips.
(FR) La présente invention concerne un procédé de moulage par injection permettant de fabriquer à l'unité des puces microfluidiques jetables en plastique dans un temps de cycle de l'ordre de quelques minutes. Ces puces microfluidiques présentent de nouvelles interconnexions intégrées, réversibles, normalisées et prêtes à l'emploi qui permettent un fonctionnement à des pressions ne pouvant pas être utilisées jusqu'à présent avec des puces microfluidiques.
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Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, MT, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
US20110300034