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1. WO2008042478 - WIDE BAND AND RADIO FREQUENCY WAVEGUIDE AND HYBRID INTEGRATION IN A SILICON PACKAGE

Publication Number WO/2008/042478
Publication Date 10.04.2008
International Application No. PCT/US2007/070870
International Filing Date 11.06.2007
IPC
H01L 23/053 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
02Containers; Seals
04characterised by the shape
053the container being a hollow construction and having an insulating base as a mounting for the semiconductor body
H01L 23/31 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulation, e.g. encapsulating layers, coatings
31characterised by the arrangement
H01L 23/66 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
58Structural electrical arrangements for semiconductor devices not otherwise provided for
64Impedance arrangements
66High-frequency adaptations
H03H 9/10 2006.01
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
9Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
02Details
05Holders or supports
10Mounting in enclosures
H01P 1/12 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
PWAVEGUIDES; RESONATORS, LINES OR OTHER DEVICES OF THE WAVEGUIDE TYPE
1Auxiliary devices
10for switching or interrupting
12by mechanical chopper
H01P 3/06 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
PWAVEGUIDES; RESONATORS, LINES OR OTHER DEVICES OF THE WAVEGUIDE TYPE
3Waveguides; Transmission lines of the waveguide type
02with two longitudinal conductors
06Coaxial lines
CPC
B81B 2201/014
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
2201Specific applications of microelectromechanical systems
01Switches
012characterised by the shape
014having a cantilever fixed on one side connected to one or more dimples
B81B 2207/07
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
2207Microstructural systems or auxiliary parts thereof
07Interconnects
B81B 7/0064
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
7Microstructural systems; ; Auxiliary parts of microstructural devices or systems
0032Packages or encapsulation
0064for protecting against electromagnetic or electrostatic interferences
B81C 2203/0109
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
2203Forming microstructural systems
01Packaging MEMS
0109Bonding an individual cap on the substrate
B81C 2203/036
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
2203Forming microstructural systems
03Bonding two components
033Thermal bonding
036Fusion bonding
H01L 2924/0002
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
0001Technical content checked by a classifier
0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applicants
  • MASSACHUSETTS INSTITUTE OF TECHNOLOGY [US]/[US] (AllExceptUS)
  • BOZLER, Carl, O. [US]/[US] (UsOnly)
  • MULDAVIN, Jeremy [US]/[US] (UsOnly)
  • WYATT, Peter, W. [US]/[US] (UsOnly)
  • KEAST, Craig, L. [US]/[US] (UsOnly)
  • RABE, Steven [US]/[US] (UsOnly)
Inventors
  • BOZLER, Carl, O.
  • MULDAVIN, Jeremy
  • WYATT, Peter, W.
  • KEAST, Craig, L.
  • RABE, Steven
Agents
  • CONNORS, Matthew E.
Priority Data
60/812,23909.06.2006US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) WIDE BAND AND RADIO FREQUENCY WAVEGUIDE AND HYBRID INTEGRATION IN A SILICON PACKAGE
(FR) GUIDE D'ONDES DE FRÉQUENCES RADIO ET LARGE BANDE ET INTÉGRATION HYBRIDE DANS UN ENSEMBLE EN SILICIUM
Abstract
(EN)
A device includes a device wafer (400) having a circuit component (375) formed thereon and having vias (300) formed therein and a cap wafer (100) bonded to the device wafer. The cap wafer has a cavity (250) therein. The cavity has a post (200) formed therein, and the post is positioned to mechanically support the vias formed in the device wafer. The cavity has a volume, the volume substantially enclosing the circuit component formed on the device wafer. The cavity has a width and height such that an impedance of a transmission line is dependent upon the width and height of the cavity, or the impedance of a transmission line is dependent upon the width of a center conductor (350) within the cavity.
(FR)
La présente invention concerne un dispositif comprenant une tranche de dispositif ayant un composant de circuit formé dessus et ayant des trous traversants formés à l'intérieur et une tranche de cache liée à la tranche de dispositif. La tranche de cache a une cavité à l'intérieur. La cavité a un montant formé à l'intérieur et le montant est positionné de façon à supporter mécaniquement les trous traversants formés dans la tranche de dispositif. La cavité a un volume, le volume englobant pour l'essentiel le composant de circuit formé sur la tranche de dispositif. La cavité a une largeur et une hauteur telles qu'une impédance de la ligne de transmission dépend de la largeur et de la hauteur de la cavité, ou que l'impédance d'une ligne de transmission dépend de la largeur d'un conducteur central situé à l'intérieur de la cavité.
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