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1. WO2008039824 - REDUCED STRESS ON SAW DIE WITH SURROUNDING SUPPORT STRUCTURES

Publication Number WO/2008/039824
Publication Date 03.04.2008
International Application No. PCT/US2007/079495
International Filing Date 26.09.2007
IPC
H03H 3/08 2006.01
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
3Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
007for the manufacture of electromechanical resonators or networks
08for the manufacture of resonators or networks using surface acoustic waves
CPC
H01L 23/562
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
562Protection against mechanical damage
H01L 2924/0002
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
0001Technical content checked by a classifier
0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
H03H 9/02535
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
9Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
02Details
02535of surface acoustic wave devices
H03H 9/02897
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
9Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
02Details
02535of surface acoustic wave devices
02818Means for compensation or elimination of undesirable effects
02897of strain or mechanical damage, e.g. strain due to bending influence
H03H 9/02984
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
9Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
02Details
02535of surface acoustic wave devices
02984Protection measures against damaging
Applicants
  • HONEYWELL INTERNATIONAL INC. [US]/[US] (AllExceptUS)
  • BUNYER, Scott, L. [US]/[US] (UsOnly)
  • MAGEE, Steven, J. [US]/[US] (UsOnly)
Inventors
  • BUNYER, Scott, L.
  • MAGEE, Steven, J.
Agents
  • BEATUS, Carrie
Priority Data
11/528,96427.09.2006US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) REDUCED STRESS ON SAW DIE WITH SURROUNDING SUPPORT STRUCTURES
(FR) REDUCTION DE CONTRAINTE SUR UNE PUCE A ONDES ACOUSTIQUES DE SURFACE AU MOYEN DE STRUCTURES DE SUPPORT ENCERCLANTES
Abstract
(EN)
A die structural support apparatus and method are disclosed, in which a die component is provided. A support element can be configured for use with the die component, wherein said support element surrounds said die component, thereby strengthening said die component to provide a surrounding die support structure thereof. The die component preferably constitutes a SAW die, and may be formed from, for example, quartz. The support element can be molded, stamped, cast, machined and so forth and is preferably located with respect to the SAW die after the SAW die is formed.
(FR)
L'invention concerne un appareil et un procédé de support structurel de puce consistant à obtenir un composant puce. Un élément de support peut être configuré pour être utilisé avec le composant puce, ledit élément entourant le composant puce, ce qui renforce ledit composant pour fournir une structure de support de puce encerclante. Le composant puce est de préférence un component à ondes acoustiques de surface et il peut être fabriqué à partir de quartz, par exemple. L'élément de support peut être moulé, estampé, coulé, usiné, etc., et il est de préférence disposé par rapport à la puce à ondes acoustiques de surface après la formation de celle-ci.
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