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1. WO2008038978 - LIGHT EMITTING DIODE PACKAGE

Publication Number WO/2008/038978
Publication Date 03.04.2008
International Application No. PCT/KR2007/004674
International Filing Date 21.09.2007
IPC
H01L 33/48 2010.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
H01L 33/54 2010.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
52Encapsulations
54having a particular shape
CPC
H01L 2224/48091
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
4805Shape
4809Loop shape
48091Arched
H01L 2224/48247
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
48221the body and the item being stacked
48245the item being metallic
48247connecting the wire to a bond pad of the item
H01L 33/486
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
483Containers
486adapted for surface mounting
H01L 33/54
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
52Encapsulations
54having a particular shape
Applicants
  • SEOUL SEMICONDUCTOR CO., LTD. [KR]/[KR] (AllExceptUS)
  • KIM, Hwa Ja [KR]/[KR] (UsOnly)
  • KIM, Nam Young [KR]/[KR] (UsOnly)
  • LEE, Myung Hee [KR]/[KR] (UsOnly)
  • HAN, Kyoung Bo [KR]/[KR] (UsOnly)
  • KIM, Tae Kwang [KR]/[KR] (UsOnly)
  • SO, Ji Seop [KR]/[KR] (UsOnly)
Inventors
  • KIM, Hwa Ja
  • KIM, Nam Young
  • LEE, Myung Hee
  • HAN, Kyoung Bo
  • KIM, Tae Kwang
  • SO, Ji Seop
Agents
  • LEE, Soo Wan
Priority Data
10-2006-009565429.09.2006KR
Publication Language English (EN)
Filing Language Korean (KO)
Designated States
Title
(EN) LIGHT EMITTING DIODE PACKAGE
(FR) ENSEMBLE DIODE ÉLECTROLUMINESCENTE
Abstract
(EN)
A side-view type light emitting diode package for emitting light, emitted from a light emitting diode chip, toward a side surface is disclosed. The side-view type light emitting diode package comprises a package body having an opening portion for exposing the light emitting diode chip in a light emitting direction; and a light-transmittable resin covering the light emitting diode chip, wherein at least a portion of an inner wall of the opening portion is formed with a step projection for partitioning the opening portion into upper and lower sections, and the lower section of the opening portion below the step projection is filled with the light-transmittable resin. Accordingly, the light-transmittable resin with the convex lens shape may be easily formed, so that the light emission efficiency thereof can be improved.
(FR)
L'invention concerne un ensemble diode électroluminescente du type à émission latérale destiné à émettre une lumière à partir d'une puce de diode électroluminescente en direction d'une surface latérale. Cet ensemble diode électroluminescente du type à émission latérale comprend un corps possédant une partie d'ouverture destinée à exposer la puce de diode électroluminescente dans un sens d'émission lumineuse, ainsi qu'une résine transparente à la lumière recouvrant la puce de diode électroluminescente. Une partie au moins d'une paroi intérieure de la partie d'ouverture présente une saillie permettant de diviser la partie d'ouverture en une section supérieure et une section inférieure, la section inférieure de la partie d'ouverture sous la saillie étant remplie de la résine transparente à la lumière. Par conséquent, la résine transparente à la lumière peut être formée facilement en vue de l'obtention d'une forme lenticulaire convexe, ce qui permet d'améliorer l'efficacité d'émission lumineuse.
Also published as
Latest bibliographic data on file with the International Bureau