Processing

Please wait...

Settings

Settings

Goto Application

1. WO2008025030 - METHOD AND SYSTEM FOR POINT OF USE TREATMENT OF SUBSTRATE POLISHING FLUIDS

Publication Number WO/2008/025030
Publication Date 28.02.2008
International Application No. PCT/US2007/076890
International Filing Date 27.08.2007
IPC
C02F 9/00 2006.01
CCHEMISTRY; METALLURGY
02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
9Multistep treatment of water, waste water or sewage
C02F 3/00 2006.01
CCHEMISTRY; METALLURGY
02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
3Biological treatment of water, waste water, or sewage
CPC
B01D 15/00
BPERFORMING OPERATIONS; TRANSPORTING
01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
DSEPARATION
15Separating processes involving the treatment of liquids with solid sorbents
B01J 41/04
BPERFORMING OPERATIONS; TRANSPORTING
01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
41Anion exchange; Use of material as anion exchangers; Treatment of material for improving the anion exchange properties
04Processes using organic exchangers
C02F 1/66
CCHEMISTRY; METALLURGY
02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
1Treatment of water, waste water, or sewage
66by neutralisation; pH adjustment
C02F 1/683
CCHEMISTRY; METALLURGY
02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
1Treatment of water, waste water, or sewage
68by addition of specified substances, e.g. trace elements, for ameliorating potable water
683by addition of complex-forming compounds
C02F 1/722
CCHEMISTRY; METALLURGY
02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
1Treatment of water, waste water, or sewage
72by oxidation
722Oxidation by peroxides
C02F 1/78
CCHEMISTRY; METALLURGY
02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
1Treatment of water, waste water, or sewage
72by oxidation
78with ozone
Applicants
  • APPLIED MATERIALS, INC. [US]/[US] (AllExceptUS)
  • GOLDEN, Josh H. [US]/[US] (UsOnly)
  • PORSHVEV, Peter I. [US]/[US] (UsOnly)
  • WOOLSTON, Michael R. [US]/[US] (UsOnly)
Inventors
  • GOLDEN, Josh H.
  • PORSHVEV, Peter I.
  • WOOLSTON, Michael R.
Agents
  • PATTERSON, B. Todd
Priority Data
60/840,16725.08.2006US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) METHOD AND SYSTEM FOR POINT OF USE TREATMENT OF SUBSTRATE POLISHING FLUIDS
(FR) procédé et système pour le traitement sur place des fluides de polissage de substrats
Abstract
(EN)
Embodiments of the invention generally provide a method and an apparatus for treating waste effluents from substrate processes, such as from an electrochemical mechanical polishing (ECMP) process. In one embodiment, a method for treating a waste effluent mixture generated during a substrate process is provided which includes flowing a waste effluent comprising chelated metal complexes from a substrate process system, combining an oxidizing agent and the waste effluent to produce free chelators, flowing the waste effluent through an organoclay media and an activated carbon media to remove the free chelators, and flowing the waste effluent through an anion exchange resin to remove metal ions and produce a waste water.
(FR)
La présente invention concerne en général un procédé et un appareil pour le traitement des effluents usés provenant de traitements de substrats, notamment à partir d'un procédé de polissage mécanique électrochimique (ECMP). Dans un mode de réalisation, un procédé de traitement d'un mélange d'effluents usés générés lors d'un traitement de substrat est proposé qui comprend faire circuler un effluent usé comprenant des complexes métalliques chélatés provenant d'un système de traitement de substrats, combiner un agent oxydant et ledit effluent pour produire des chélateurs libres, faire circuler ledit effluent à travers un milieu d'argile organique et un milieu de charbon activé afin d'éliminer les chélateurs libres, et faire circuler ledit effluent à travers une résine échangeuse d'ions afin d'éliminer les ions métalliques et produire une eau d'égout.
Also published as
Latest bibliographic data on file with the International Bureau