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1. WO2008016120 - INSULATING POLYMER MATERIAL COMPOSITION

Publication Number WO/2008/016120
Publication Date 07.02.2008
International Application No. PCT/JP2007/065199
International Filing Date 02.08.2007
IPC
C08G 59/20 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
20characterised by the epoxy compounds used
C08J 3/24 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
3Processes of treating or compounding macromolecular substances
24Crosslinking, e.g. vulcanising, of macromolecules
H01B 3/40 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
3Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
18mainly consisting of organic substances
30plastics; resins; waxes
40epoxy resins
CPC
C08G 59/42
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
59Polycondensates containing more than one epoxy group per molecule
18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; ; e.g. general methods of curing
40characterised by the curing agents used
42Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
C08G 59/4284
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
59Polycondensates containing more than one epoxy group per molecule
18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; ; e.g. general methods of curing
40characterised by the curing agents used
42Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
4284together with other curing agents
H01B 3/20
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
3Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
18mainly consisting of organic substances
20liquids, e.g. oils
H01B 3/40
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
3Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
18mainly consisting of organic substances
30plastics; resins; waxes
40epoxy resins
Applicants
  • 株式会社明電舎 MEIDENSHA CORPORATION [JP]/[JP] (AllExceptUS)
  • 蔵田 保幸 KURATA, Yasuyuki (UsOnly)
Inventors
  • 蔵田 保幸 KURATA, Yasuyuki
Agents
  • 橋本 剛 HASHIMOTO, Takeshi
Priority Data
2006-21084502.08.2006JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) INSULATING POLYMER MATERIAL COMPOSITION
(FR) COMPOSITION DE MATÉRIAU POLYMÈRE ISOLANT
(JA) 絶縁性高分子材料組成物
Abstract
(EN)
An insulating polymer material composition is obtained by adding, to an epoxidized soybean oil, an acid anhydride as a curing agent and an organic peroxide such as dicumyl peroxide as a curing accelerator (for example, in an amount of 0.5-16.0 phr), kneading the resulting under conditions corresponding to the added amounts, and then heat-treating the kneaded product, thereby causing peroxide curing and three-dimensional crosslinking. This insulating polymer material composition is applied to polymer products such as high-voltage devices.
(FR)
La présente invention concerne une composition de matériau polymère isolante obtenue en ajoutant, à une huile de soja à modification époxydique, un anhydride d'acide en tant qu'agent durcissant et un peroxyde organique tel que le dicumylperoxyde en tant qu'accélérateur de durcissement (par exemple en une quantité de 0,5 à 16,0 phr), puis en malaxant le produit résultant dans des conditions correspondant aux quantités ajoutées, puis en chauffant le produit malaxé, afin de provoquer le durcissement du peroxyde et une réticulation tridimensionnelle. La composition de l'invention est appliquée à des produits polymères tels que des dispositifs haute tension.
(JA)
 エポキシ化大豆油に対して、硬化剤として酸無水物を添加し、硬化促進剤としてジクミルパーオキサイド等の有機過酸化物を添加(例えば、0.5phr~16.0phrの範囲で添加)し、その添加量に応じた条件で混練し該混練物を熱処理することにより、過酸化物加硫を施し三次元架橋させて絶縁性高分子材料組成物を得る。この絶縁性高分子材料組成物を、高電圧機器等の高分子製品に適用する。
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