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1. (WO2008003176) LIGHTING DEVICE PACKAGE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2008/003176 International Application No.: PCT/CA2007/001196
Publication Date: 10.01.2008 International Filing Date: 06.07.2007
IPC:
H01L 23/28 (2006.01) ,H01L 33/54 (2010.01) ,H01L 33/56 (2010.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
52
Encapsulations
54
having a particular shape
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
52
Encapsulations
56
Materials, e.g. epoxy or silicone resin
Applicants:
TIR TECHNOLOGY LP [US/CA]; 7700 Riverfront Gate Burnaby, British Columbia V5J 5M4, CA (AllExceptUS)
ASHDOWN, Ian [CA/CA]; CA (UsOnly)
HARRAH, Shane [US/US]; US (UsOnly)
Inventors:
ASHDOWN, Ian; CA
HARRAH, Shane; US
Agent:
MBM INTELLECTUAL PROPERTY LAW LLP; 2200-200 Granville Street Vancouver, British Columbia V6C 1S4, CA
Priority Data:
60/806,69406.07.2006US
Title (EN) LIGHTING DEVICE PACKAGE
(FR) EMBALLAGE DE DISPOSITIF D'ÉCLAIRAGE
Abstract:
(EN) The invention provides a lighting device package with one or more light-emitting elements operatively coupled to a substrate; a compound lens disposed to interact with light emitted by the one or more light-emitting elements, the compound lens including at least an inner lens element and an outer lens element, the inner lens element having a first index of refraction and the outer lens element having a second index of refraction, the first index of refraction being greater than the second index of refraction; the compound lens, the one or more light-emitting elements and the substrate defining an enclosed space between them; and an encapsulation material filling at least part of said space, the encapsulation material having a third index of refraction equal or greater than the first index of refraction.
(FR) L'invention concerne un emballage de dispositif d'éclairage ayant un ou plusieurs éléments émettant de la lumière couplée de façon opérationnelle à un substrat ; une lentille composite disposée pour interagir avec la lumière émise par les éléments émettant de la lumière, la lentille composite comprenant au moins un élément de lentille interne et un élément de lentille externe, l'élément de lentille interne ayant un premier indice de réfraction et l'élément de lentille externe ayant un second indice de réfraction, le premier indice de réfraction étant supérieur au second indice de réfraction ; la lentille composite, les éléments émettant de la lumière et le substrat définissant un espace fermé entre eux ; et une matière d'encapsulation remplissant au moins une partie dudit espace, la matière d'encapsulation ayant un troisième indice de réfraction égal ou supérieur au premier indice de réfraction.
front page image
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, MT, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
KR1020090031446EP2041805JP2009543321CN101485004IN98/CHENP/2009