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1. WO2007150066 - FLUIDIC SELF-ASSEMBLY FOR SYSTEM INTEGRATION

Publication Number WO/2007/150066
Publication Date 27.12.2007
International Application No. PCT/US2007/072038
International Filing Date 25.06.2007
Chapter 2 Demand Filed 21.04.2008
IPC
H05K 1/18 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
18Printed circuits structurally associated with non-printed electric components
H05K 3/20 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
10in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
20by affixing prefabricated conductor pattern
CPC
H01L 2224/2919
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
28Structure, shape, material or disposition of the layer connectors prior to the connecting process
29of an individual layer connector
29001Core members of the layer connector
29099Material
2919with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
H01L 2224/81143
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
81using a bump connector
8112Aligning
81143Passive alignment, i.e. self alignment, e.g. using surface energy, chemical reactions, thermal equilibrium
H01L 2224/81192
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
81using a bump connector
8119Arrangement of the bump connectors prior to mounting
81192wherein the bump connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
H01L 2224/8121
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
81using a bump connector
812Applying energy for connecting
8121using a reflow oven
H01L 2224/81815
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
81using a bump connector
818Bonding techniques
81801Soldering or alloying
81815Reflow soldering
H01L 2224/83801
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
83using a layer connector
838Bonding techniques
83801Soldering or alloying
Applicants
  • UNIVERSITY OF WASHINGTON [US]/[US] (AllExceptUS)
  • AMIRPARVIZ, Babak [IR]/[US] (UsOnly)
  • STAUTH, Sean [US]/[US] (UsOnly)
Inventors
  • AMIRPARVIZ, Babak
  • STAUTH, Sean
Agents
  • DODGE, Ryan, E.
Priority Data
60/816,21723.06.2006US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) FLUIDIC SELF-ASSEMBLY FOR SYSTEM INTEGRATION
(FR) AUTO-ASSEMBLAGE FLUIDE POUR INTÉGRATION DE SYSTÈME
Abstract
(EN)
A method for self-assembly is disclosed that accomplishes the assembly process in one step, obviating or mitigating the need for post-processing of an assembled macro- electronic device. Microcomponents are fabricated having a particular shape, and a template with embedded interconnects is fabricated having recessed binding sites that are sized to receive particular microcomponent types. The binding sites include a low melting point alloy for electrically connecting received microcomponents to the interconnect network. The template is placed in a liquid, and the microcomponents are introduced to the liquid such that the microcomponents flow or slide along the template propelled by gravity and/or fluid-dynamic forces and some of them are received into the binding sites, and retained by capillary forces. The liquid is heated before or after introduction of the microcomponents to melt the alloy. The fluid and/or template are then cooled to harden the alloy, binding the microcomponents.
(FR)
La présente invention concerne un procédé d'auto-assemblage qui accomplit le procédé d'assemblage en une étape, en évitant ou atténuant la nécessité d'un post-traitement d'un dispositif macroélectronique assemblé. Des microcomposants sont fabriqués, lesquels ont une forme particulière, et un modèle avec des interconnexions noyées est fabriqué, lequel comporte des sites de liaison en retrait qui sont dimensionnés afin de recevoir des types de microcomposants particuliers. Les sites de liaison incluent un alliage à bas point de fusion afin de connecter électriquement des microcomposants reçus au réseau d'interconnexions. Le modèle est placé dans un liquide, et les microcomposants sont introduits dans le liquide de telle manière à ce que les microcomposants s'écoulent ou glissent le long du modèle propulsés par la gravité et/ou des forces à dynamique de fluide et certains d'entre eux sont reçus dans des sites de liaison, et retenus par des forces capillaires. Le liquide est chauffé avant ou après l'introduction des microcomposants pour faire fondre l'alliage. Le fluide et/ou le modèle sont ensuite refroidis afin de durcir l'alliage liant les microcomposants.
Also published as
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