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1. WO2007148890 - METHOD FOR MANUFACTURING ELECTRICAL TESTING APPARATUS

Note: Text based on automatic Optical Character Recognition processes. Please use the PDF version for legal matters

[ EN ]

[CLAIMS]

[Claim 1 ] A method for manufacturing an electrical testing apparatus comprising:
coating a first photoresist layer on a probe reinforcing substrate having signal lines which pass through the probe reinforcing substrate to transmit electrical signals to an electrical testing part for performing a test on an electrical testing target;
forming a first photoresist pattern in a cylindrical shape by exposing and developing the first photoresist layer;
performing a thermal flow process on the first photoresist pattern to form support molds having inclined side surfaces in a cone or truncated cone;
forming a seed layer which is connected to the signal lines and covers the support molds;
forming a probe beam mold on the seed layer, the probe beam mold having a first opening portion extended to peaks of the support molds along the inclined side surfaces of the support molds ;
forming conductive probe beams to be filled in the first opening portion;
sequentially removing the probe beam mold, a portion of the seed layer below the probe beam mold and the support molds to form probe beams protruded from the probe reinforcing substrate;
forming a protective layer to fixedly support the probe beams and expose the peaks of the probe beams;
forming a probe tip mold on the protective layer to have a second opening portion which exposes the peaks of the probe beams;
forming conductive probe tips at the peaks of the probe beams by filling the second opening portion; and
sequentially and selectively removing the probe tip mold and the protective layer to expose probes including the probe beams and the probe tips.

[Claim 2] The method according to claim 1, wherein, the support molds are formed in a circular cone or truncated cone to have the inclined side surfaces such that a peak portion of the support molds has a smaller width than a bottom portion of the support molds.

[Claim 3] The method according to claim 1, wherein a number of the support molds are formed in two rows to be spaced from each other such that a number of the probes are arranged in two rows on the probe reinforcing substrate, or wherein a number of the support molds are formed in a matrix to be spaced from each other such that a number of the probes are arranged in a matrix on the probe reinforcing substrate.

[Claim 4] The method according to claim 1, wherein the probe beam mold is formed to have the first opening portion spirally extended while winding on the inclined side surfaces of the support molds such that the probe beams are vertically and spirally protruded from the probe reinforcing substrate.

[Claim 5] The method according to claim 1, wherein the probe beam mold is formed to have the first opening portion obliquely extended while winding on the inclined side surfaces of the support molds such that the probe beams are formed into oblique beams which are bent and protruded while winding on the inclined side surfaces of the support molds.

[Claim 6] The method according to claim 1, wherein the probe beam mold is formed to have the first opening portion extended while winding up and down to and from the peaks on the inclined side surfaces of the support molds such that each of the probe beams includes at least two oblique beams which are bent and protruded while winding on the inclined side surfaces of the support molds.

[Claim 7] The method according to claim 1, wherein the forming a probe beam mold comprises:
coating a second photoresist layer to cover the seed layer; and
forming a second photoresist pattern having the first opening portion by exposing and developing the second photoresist layer.

[Claim 8] The method according to claim 1, wherein the probe beams are formed by electrically plating a first plating layer on the seed layer exposed by the first opening portion.

[Claim 9] The method according to claim 1, further comprising coating an insulating coating film to cover and insulate exposed surfaces of the probe beams after selectively removing the support molds.

[Claim 10] The method according to claim 1, wherein the forming a protective layer comprises:
coating a third photoresist layer to be filled in a space between the exposed probe beams; and
planarizing the third photoresist layer to expose the peaks of the probe beams.

[Claim 11) The method according to claim 1, wherein the forming a probe tip mold comprises:
coating a fourth photoresist layer on the protective layer; and
forming a fourth photoresist pattern having the second opening portion by exposing and developing the fourth photoresist layer.

[Claim 12) The method according to claim 1, wherein the forming conductive probe tips comprises: electrically plating a second plating layer at a portion of the probe beams exposed by the second opening portion; and
planarizing the second plating layer,
wherein the electrically plating the second plating layer comprises:
depositing a lower conductive layer on a rear surface of the probe reinforcing substrate to transmit current to the probe beams through the signal lines; and
selectively removing the lower conductive layer after electrically plating the second plating layer.

[Claim 13] The method according to claim 1, wherein the probes are formed to include Nickel (Ni) alloy.

[Claim 14] A method for manufacturing an electrical testing apparatus comprising:
coating a first photoresist layer on a probe reinforcing substrate having signal lines which pass through the probe reinforcing substrate to transmit electrical signals to an electrical testing part for performing a test on an electrical testing target;
performing a first exposure using exposure light which is projected perpendicularly to the photoresist layer;
performing a second exposure using inclined exposure light which is projected obliquely onto the photoresist layer while rotating the probe reinforcing substrate;
forming support molds having inclined side surfaces in a cone or truncated cone by developing the first and the second exposed photoresist layer;
forming a seed layer which is connected to the signal lines and covers the support molds;
forming a probe beam mold on the seed layer, the probe beam mold having a first opening portion extended to peaks of the support molds along the inclined side surfaces of the support molds;
forming conductive probe beams to be filled in the first opening portion;

sequentially removing the probe beam mold, a portion of the seed layer below the probe beam mold and the support molds to form probe beams protruded from the probe reinforcing substrate;
forming a protective layer to fixedly support the probe beams and expose the peaks of the probe beams;
forming a probe tip mold on the protective layer to have a second opening portion which exposes the peaks of the probe beams;
forming conductive probe tips at the peaks of the probe beams by filling the second opening portion; and
sequentially and selectively removing the probe tip mold and the protective layer to expose probes including the probe beams and the probe tips.

[Claim 15] A method for manufacturing an electrical testing apparatus comprising:
forming a photoresist pattern having an inclined side surface protruded from a probe reinforcing substrate having signal lines which pass through the probe reinforcing substrate to transmit electrical signals to an electrical testing part for performing a test on an electrical testing target;
forming a seed layer which is connected to the signal lines and covers the photoresist pattern;
forming a probe beam mold on the seed layer, the probe beam mold having a first opening portion extended to a peak of the photoresist pattern along the inclined side surface of the photoresist pattern;
forming conductive probe beams to be filled in the first opening portion;
sequentially removing the probe beam mold, a portion of the seed layer below the probe beam mold and the photoresist pattern to form probe beams protruded from the probe reinforcing substrate;
forming a protective layer to fixedly support the probe beams and expose the peaks of the probe beams;

forming a probe tip mold on the protective layer to have a second opening portion which exposes the peaks of the probe beams;
forming conductive probe tips at the peaks of the probe beams by filling the second opening portion; and
sequentially and selectively removing the probe tip mold and the protective layer to expose probes including the probe beams and the probe tips.