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1. WO2007148470 - TREATING APPARATUS, METHOD OF TREATING AND PLASMA SOURCE

Publication Number WO/2007/148470
Publication Date 27.12.2007
International Application No. PCT/JP2007/058593
International Filing Date 20.04.2007
IPC
H01L 21/304 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304Mechanical treatment, e.g. grinding, polishing, cutting
B01J 19/08 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
19Chemical, physical or physico-chemical processes in general; Their relevant apparatus
08Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
B08B 3/02 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
08CLEANING
BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
3Cleaning by methods involving the use or presence of liquid or steam
02Cleaning by the force of jets or sprays
B08B 5/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
08CLEANING
BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
5Cleaning by methods involving the use of air flow or gas flow
B08B 7/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
08CLEANING
BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
7Cleaning by methods not provided for in a single other subclass or a single group in this subclass
G03F 7/42 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
26Processing photosensitive materials; Apparatus therefor
42Stripping or agents therefor
CPC
B08B 3/08
BPERFORMING OPERATIONS; TRANSPORTING
08CLEANING
BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
3Cleaning by methods involving the use or presence of liquid or steam
04Cleaning involving contact with liquid
08the liquid having chemical or dissolving effect
B08B 7/00
BPERFORMING OPERATIONS; TRANSPORTING
08CLEANING
BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
7Cleaning by methods not provided for in a single other subclass or a single group in this subclass
B08B 7/0035
BPERFORMING OPERATIONS; TRANSPORTING
08CLEANING
BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
7Cleaning by methods not provided for in a single other subclass or a single group in this subclass
0035by radiant energy, e.g. UV, laser, light beam or the like
G03F 7/42
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
26Processing photosensitive materials; Apparatus therefor
42Stripping or agents therefor
G03F 7/427
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
26Processing photosensitive materials; Apparatus therefor
42Stripping or agents therefor
427using plasma means only
H01L 21/02057
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
02041Cleaning
02057Cleaning during device manufacture
Applicants
  • リバーベル株式会社 RIVER BELL CO. [JP]/[JP] (AllExceptUS)
  • 国立大学法人東京工業大学 TOKYO INSTITUTE OF TECHNOLOGY [JP]/[JP] (AllExceptUS)
  • 鐘ヶ江 正巳 KANEGAE, Masatomo [JP]/[JP] (UsOnly)
  • 沖野 晃俊 OKINO, Akitoshi [JP]/[JP] (UsOnly)
  • 宮原 秀一 MIYAHARA, Hidekazu [JP]/[JP] (UsOnly)
Inventors
  • 鐘ヶ江 正巳 KANEGAE, Masatomo
  • 沖野 晃俊 OKINO, Akitoshi
  • 宮原 秀一 MIYAHARA, Hidekazu
Agents
  • 中尾 俊輔 NAKAO, Shunsuke
Priority Data
2006-17238822.06.2006JP
2006-19693119.07.2006JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) TREATING APPARATUS, METHOD OF TREATING AND PLASMA SOURCE
(FR) APPAREIL DE TRAITEMENT, PROCÉDÉ DE TRAITEMENT ET SOURCE DE PLASMA
(JA) 処理装置、処理方法及びプラズマ源
Abstract
(EN)
A treating apparatus, and method of treating, being capable of shortening the lead time and being more reliable in treating performance than in the prior art. There is provided an apparatus comprising chamber (1); holding means (3) for holding of treatment object (2), disposed in the chamber; active atom feeding means (4) for feeding of active atoms into the chamber; and chemical solution feeding means (5) for feeding of a solution of chemical into the chamber so as to carry out not only dry treatment by the active atoms fed by the active atom feeding means but also wet treatment by the solution of chemical fed by the chemical solution feeding means on the surface of the treatment object.
(FR)
L'invention concerne un appareil de traitement et un procédé de traitement, capables de raccourcir le temps de mise en route et dont la performance de traitement est plus que l'état antérieur de la technique. Il est proposé un appareil comprenant une chambre (1) ; des moyens de maintien (3) de l'objet de traitement (2) disposés dans la chambre ; des moyens d'alimentation en atome actif (4) alimentant la chambre en atomes actifs ; et des moyens d'alimentation en solution de substances chimiques (5) amenant une solution de substances chimiques dans la chambre afin de réaliser non seulement un traitement à sec par les atomes actifs amenés par les moyens d'alimentation en atomes actifs mais aussi un traitement humide à partir de la solution de substances chimiques amenée par les moyens d'alimentation en solution de substances chimiques sur la surface de l'objet à traiter.
(JA)
not available
Latest bibliographic data on file with the International Bureau