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1. WO2007148395 - SLIPPERY METAL LAMINATE AND PROCESS FOR PRODUCING THE SAME

Publication Number WO/2007/148395
Publication Date 27.12.2007
International Application No. PCT/JP2006/312482
International Filing Date 22.06.2006
IPC
B32B 15/08 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15Layered products essentially comprising metal
04comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
08of synthetic resin
B29C 65/48 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
65Joining of preformed parts; Apparatus therefor
48using adhesives
C08J 7/00 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
7Chemical treatment or coating of shaped articles made of macromolecular substances
CPC
B29C 2059/027
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
59Surface shaping ; of articles; , e.g. embossing; Apparatus therefor
02by mechanical means, e.g. pressing
027Grinding; Polishing
B29C 59/04
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
59Surface shaping ; of articles; , e.g. embossing; Apparatus therefor
02by mechanical means, e.g. pressing
04using rollers or endless belts
B32B 15/08
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15Layered products comprising ; a layer of; metal
04comprising metal as the main or only constituent of a layer, ; which is next to another layer of the same or of a different material
08of synthetic resin
H05K 2201/0154
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
01Dielectrics
0137Materials
0154Polyimide
H05K 2203/025
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2203Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
02Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
025Abrading, e.g. grinding or sand blasting
H05K 3/022
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
02in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Applicants
  • 東レ・デュポン株式会社 DU PONT-TORAY COMPANY, LTD. [JP]/[JP] (AllExceptUS)
  • 沢崎 孔一 SAWASAKI, Koichi [JP]/[JP] (UsOnly)
  • 手柴 敏博 TESHIBA, Toshihiro [JP]/[JP] (UsOnly)
Inventors
  • 沢崎 孔一 SAWASAKI, Koichi
  • 手柴 敏博 TESHIBA, Toshihiro
Agents
  • 岩見 知典 IWAMI, Tomonori
Priority Data
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) SLIPPERY METAL LAMINATE AND PROCESS FOR PRODUCING THE SAME
(FR) STRATIFIÉ MÉTALLIQUE GLISSANT ET SON PROCÉDÉ DE FABRICATION
(JA) 易滑性金属積層体およびその製造方法
Abstract
(EN)
A slippery metal laminate excelling in slipperiness that in the lamination of multilayer substrate by means of a hot press, reduces the inter-film adhesion at a hinge portion, enabling elimination of any 'sounding' trouble caused by inter-film friction. There is provided a metal laminate comprising a polyimide film of 0.1 to 0.7 inter-film surface static friction coefficient, preferably 0.7 to 10 &mgr;m film surface roughness (Rz), having streaky unevenness on its surface as a base material and, superimposed on the backside thereof, a metal. Further, there is provided a process for producing a slippery metal laminate, characterized in that a metal laminate having a metal superimposed through an adhesive on a polyimide film on the polyimide film surface is rubbed using a grinding tape to thereby form streaky unevenness on the film surface and realize an inter-film surface static friction coefficient of 0.1 to 0.7.
(FR)
L'invention concerne un stratifié métallique glissant excellent en matière de glissance qui, lors du laminage de substrat multicouche par presse à chaud, réduit l'adhérence entre les films à une partie charnière, ce qui permet d'éliminer tout problème de 'bruit' provoqué par frottement entre les films. L'invention concerne un stratifié métallique comprenant un film polyimide d'indice de frottement statique superficiel entre les films compris entre 0,1 et 0,7, de préférence de rugosité de surface superficielle (Rz) comprise entre 0,7 et 10&mgr;m, présentant une irrégularité striée sur sa surface comme matériau de base et, superposé sur son envers, un métal. De plus, l'invention concerne un procédé permettant de produire un stratifié métallique glissant, se caractérisant en ce qu'un stratifié métallique présentant un métal superposé par le biais d'un adhésif sur un film polyimide sur la surface de film polyimide est frotté par une bande abrasive de façon à former une irrégularité striée sur la surface du film et obtenir un indice de frottement statique superficiel entre les films compris entre 0,1 et 0,7.
(JA)
 多層の基板を加熱プレスにより積層した際のヒンジ部におけるフィルム同士の密着を低減し、フィルム同士が擦れあっての「音鳴り」トラブルを解消することのできる易滑性に優れた易滑性金属積層体を提供する。  表面にスジ状の凹凸を有し、フィルム表面同士の静摩擦係数が0.1~0.7、好ましくはフィルム表面粗さRzが0.7~10μmであるポリイミドフィルムを基材とし、この裏面に金属が積層された金属積層体。  ポリイミドフィルムに接着剤を介して金属が積層された金属積層体のポリイミドフィルム面を研磨テープで擦過することによって、フィルム表面にスジ状の凹凸を形成させ、フィルム表面同士の静摩擦係数を0.1~0.7にすることを特徴とする易滑性金属積層体の製造方法。
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