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1. WO2007147602 - METHOD FOR PRODUCING A CIRCUIT PART ON A SUBSTRATE

Publication Number WO/2007/147602
Publication Date 27.12.2007
International Application No. PCT/EP2007/005489
International Filing Date 21.06.2007
IPC
H05K 3/10 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
10in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
CPC
G03G 15/6585
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
GELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
15Apparatus for electrographic processes using a charge pattern
65Apparatus which relate to the handling of copy material
6582Special processing for irreversibly adding or changing the sheet copy material characteristics or its appearance, e.g. stamping, annotation printing, punching
6585by using non-standard toners, e.g. transparent toner, gloss adding devices
H05K 1/036
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
03Use of materials for the substrate
0313Organic insulating material
0353consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
036Multilayers with layers of different types
H05K 1/0393
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
03Use of materials for the substrate
0393Flexible materials
H05K 1/16
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
16incorporating printed electric components, e.g. printed resistor, capacitor, inductor
H05K 2201/0129
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
01Dielectrics
0104Properties and characteristics in general
0129Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
H05K 2203/0517
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2203Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
05Patterning and lithography; Masks; Details of resist
0502Patterning and lithography
0517Electrographic patterning
Applicants
  • AHNERT, Axel [DE]/[DE]
  • GRANDY, Elmar [DE]/[DE]
Inventors
  • AHNERT, Axel
  • GRANDY, Elmar
Agents
  • STRASSER, Wolfgang
Priority Data
10 2006 028 536.021.06.2006DE
Publication Language German (DE)
Filing Language German (DE)
Designated States
Title
(DE) VERFAHREN ZUR HERSTELLUNG EINES SCHALTUNGSTEILS AUF EINEM SUBSTRAT
(EN) METHOD FOR PRODUCING A CIRCUIT PART ON A SUBSTRATE
(FR) PROCÉDÉ DE PRODUCTION D'UNE PORTION DE CIRCUIT SUR UN SUBSTRAT
Abstract
(DE)
Ein Verfahren zum Herstellen mindestens eines Schaltungsteils auf einem Substrat (20) umfasst die Schritte Deponieren mindestens eines Granulats (54), das einen elektrischen Leiter enthält, mit einer vorbestimmten geometrischen Verteilung auf dem Substrat (20), und Erhitzen des Granulats (54), wobei das Granulat (54) eine dauerhafte Verbindung mit dem Substrat (20) eingeht und das mindestens eine Schaltungsteil auf dem Substrat. (20) bildet. Es werden auch eine Platine, umfassend mindestens ein Substrat, auf dem mindestens ein Schaltungsteil angeordnet ist, und eine Vorrichtung zur Herstellung von mindestens einem Schaltungsteil auf einem Substrat (20) beschrieben.
(EN)
The invention relates to a method for producing at least one circuit part on a substrate (20). Said method comprises the following steps: at least one granulate (54), which contains an electric conductor and which has a predefined geometric distribution, is deposited on the substrate (20) and the granulate (54) is heated and forms a permanent connection with the substrate (20) and forms at least one circuit part on the substrate (20). The invention also relates to a circuit board comprising at least one substrate, on which at least one circuit part is arranged, and to a device for producing at least one circuit part on a substrate (20).
(FR)
L'invention concerne un procédé de production d'au moins une portion de circuit sur un substrat (20), procédé comprenant les étapes suivantes : dépôt d'au moins un granulé (54) renfermant un conducteur électrique, suivant une distribution géométrique prédéterminée, sur le substrat (20), et chauffage du granulé (54), ledit granulé (54) entrant alors en liaison permanente avec le substrat (20) et formant au moins une portion du circuit sur le substrat (20). L'invention concerne en outre une platine, comprenant au moins un substrat, sur lequel est disposée au moins une portion de circuit, et un dispositif de production d'au moins une portion de circuit sur un substrat (20).
Also published as
EP2007726119
Latest bibliographic data on file with the International Bureau