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1. WO2007146888 - VAPOR DELIVERY TO DEVICES UNDER VACUUM

Publication Number WO/2007/146888
Publication Date 21.12.2007
International Application No. PCT/US2007/070900
International Filing Date 11.06.2007
IPC
B01D 1/26 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
DSEPARATION
1Evaporating
26Multiple-effect evaporating
CPC
C23C 14/228
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22characterised by the process of coating
228Gas flow assisted PVD deposition
C23C 14/48
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22characterised by the process of coating
48Ion implantation
H01J 2237/006
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
2237Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
006Details of gas supplies, e.g. in an ion source, to a beam line, to a specimen or to a workpiece,
H01J 2237/022
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
2237Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
02Details
022Avoiding or removing foreign or contaminating particles, debris or deposits on sample or tube
H01J 2237/08
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
2237Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
06Sources
08Ion sources
H01J 2237/31701
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
2237Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
30Electron or ion beam tubes for processing objects
317Processing objects on a microscale
31701Ion implantation
Applicants
  • SEMEQUIP, INC. [US]/[US] (AllExceptUS)
  • ADAMS, Douglas, R. [US]/[US] (UsOnly)
  • SINCLAIR, Frank [US]/[US] (UsOnly)
  • COPERTINO, Brent, M. [US]/[US] (UsOnly)
Inventors
  • ADAMS, Douglas, R.
  • SINCLAIR, Frank
  • COPERTINO, Brent, M.
Agents
  • PANIAGUAS, John, S.
Priority Data
60/804,55512.06.2006US
60/860,63122.11.2006US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) VAPOR DELIVERY TO DEVICES UNDER VACUUM
(FR) INJECTION DE VAPEUR DANS DES DISPOSITIFS À VIDE
Abstract
(EN)
Providing vapor to a vapor-receiving device housed in a high vacuum chamber. An ion beam implanter, as an example, has a removable high voltage ion source within a high vacuum chamber and a vapor delivery system that delivers vapor to the ion source and does not interfere with removal of the ion source for maintenance. For delivering vapor to a vapor-receiving device, such as the high voltage ion source under vacuum, a flow interface device is in the form of a thermally conductive valve block. A delivery extension of the interface device automatically connects and disconnects within the high vacuum chamber with the removable vapor receiving device by respective installation and removal motions. In an ion implanter, the flow interface device or valve block and source of reactive cleaning gas are mounted in a non-interfering way on the electrically insulating bushing that insulates the ion source from the vacuum housing and the ion source may be removed without disturbing the flow interface device. Multiple vaporizers for solid material, provisions for reactive gas cleaning, and provisions for controlling flow are provided in the flow interface device.
(FR)
L'invention vise à fournir de la vapeur à un dispositif de réception de vapeur logé dans une chambre à vide poussé. Un système d'implantation de faisceau ionique, à titre d'exemple, possède une source ionique haute tension amovible dans une chambre à vide poussé et un système d'injection de vapeur qui achemine de la vapeur à la source ionique et ne compromet pas l'extraction de la source ionique pour maintenance. Pour acheminer de la vapeur à un dispositif de réception de vapeur, comme la source ionique haute tension à vide, un dispositif interface d'écoulement est sous forme d'un bloc valve thermiquement conducteur. Une extension d'injection du dispositif interface se connecte et se déconnecte automatiquement dans la chambre à vide poussé avec le dispositif de réception de vapeur amovible grâce des mouvements respectifs d'installation et d'extraction. Dans un système d'implantation ionique, le dispositif interface d'écoulement ou le bloc valve et la source de gaz de nettoyage réactif sont montés sans interférence sur la douille isolante électriquement servant à isoler la source ionique du logement à vide et la source ionique peut être retirée sans gêner le dispositif interface d'écoulement. De multiples vaporisateurs pour matériau solide, aménagements pour le nettoyage au gaz réactif, et aménagements permettant de commander le flux sont montés dans le dispositif interface d'écoulement.
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